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preliminarysubject to change without notice the mpc7451 is a reduced instruction set computing (risc) microprocessor that implements the powerpc instruction set architecture. this document describes pertinent electrical and physical characteristics of the mpc7451. for functional characteristics of the processor, refer to the mpc7450 risc microprocessor family users manual . this document contains the following topics: topic page section 1.1, overview 1 section 1.2, features 3 section 1.3, comparison with the mpc7400 7 section 1.4, general parameters 9 section 1.5, electrical and thermal characteristics 10 section 1.6, pin assignments 30 section 1.7, pinout listings for the 483 cbga package 31 section 1.8, package description 34 section 1.9, system design information 36 section 1.10, document revision history 49 section 1.11, ordering information 50 to locate any published updates for this document, refer to the website at http://www.motorola.com/semiconductors 1.1 overview the mpc7451 is the third implementation of the fourth generation (g4) microprocessors from motorola. the mpc7451 implements the full powerpc 32-bit architecture and is targeted at networking and computing systems applications. the mpc7451 consists of a processor core, a 256-kbyte l2, and an internal l3 tag and controller which support a glueless backside l3 cache through a dedicated high bandwidth interface. figure 1 shows a block diagram of the mpc7451. the core is a high-performance superscalar design supporting a double-precision floating-point unit and a simd multimedia unit. the memory storage subsystem supports the mpx bus interface to main memory and other system resources. the l3 interface supports 1 or 2 mbytes of external sram for l3 cache data. note that the mpc7451 is a footprint-compatible, drop-in replacement in a mpc7450 application as long as the core power supply is 1.6 v. advance information mpc7451ec/d rev. 0.1, 11/2001 mpc7451 risc microprocessor hardware specifications
2 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice overview figure 1. mpc7451 block diagram + integer reservation station unit 2 + integer reservation station unit 2 additional features ? time base counter/decrementer ? clock multiplier ? jtag/cop interface ? thermal/power management ? performance monitor + + x fpscr fpscr pa + x instruction unit instruction queue (12-word) 96-bit (3 instructions) reservation integer 128-bit (4 instructions) 32-bit floating- point unit 64-bit reservation load/store unit (ea calculation) finished 32-bit completion unit completion queue (16-entry) ta g s 32-kbyte d cache l3 cache controller system bus interface 36-bit address bus 64-bit data bus 18-bit 64-bit data integer stations (2) reservation station reservation stations (2) fpr file 16 rename buffers stations (2-entry) gpr file 16 rename buffers reservation station vr file 16 rename buffers 64-bit 128-bit 128-bit completes up to three instructions per clock completed instruction mmu srs (shadow) 128-entry ibat array itlb ta g s 32-kbyte i cache stores stores load miss vector to u c h queue (3) vr issue fpr issue branch processing unit ctr lr btic (128-entry) bht (2048-entry) fetcher gpr issue (6-entry/3-issue) (4-entry/2-issue) (2-entry/1-issue) dispatch unit 256-kbyte unified l2 cache/cache controller data mmu srs (original) 128-entry dbat array dtlb vector touch engine 32-bit ea l1 castout status l2 store queue (l2sq) external sram l3cr (8-bit parity) address vector fpu reservation station reservation station reservation station vector integer unit 1 vector integer unit 2 vector permute unit line status ta g s bus accumulator ta g s block 0 (32-byte) status block 1 (32-byte) block 0/1 line memory subsystem l1 load queue (llq) l1 load miss (5) cacheable store instruction fetch (2) request (1) l1 service queues snoop push/ interventions l1 store queue l1 castouts push castout queue bus store queue l2 prefetch (3) bus accumulator (1 or 2 mbytes) (lsq) l1 push (4) (9) unit 2 unit 1
motorola mpc7451 risc microprocessor hardware specifications 3 preliminarysubject to change without notice features 1.2 features this section summarizes features of the mpc7451 implementation of the powerpc architecture. major features of the mpc7451 are as follows: major features of the mpc7451 are as follows: ? high-performance, superscalar microprocessor as many as 4 instructions can be fetched from the instruction cache at a time as many as 3 instructions can be dispatched to the issue queues at a time as many as 12 instructions can be in the instruction queue (iq) as many as 16 instructions can be at some stage of execution simultaneously single-cycle execution for most instructions one instruction per clock cycle throughput for most instructions seven-stage pipeline control ? eleven independent execution units and three register files branch processing unit (bpu) features static and dynamic branch prediction C 128-entry (32-set, four-way set-associative) branch target instruction cache (btic), a cache of branch instructions that have been encountered in branch/loop code sequences. if a target instruction is in the btic, it is fetched into the instruction queue a cycle sooner than it can be made available from the instruction cache. typically, a fetch that hits the btic provides the first four instructions in the target stream. C 2048-entry branch history table (bht) with two bits per entry for four levels of prediction not-taken, strongly not-taken, taken, strongly taken C up to three outstanding speculative branches C branch instructions that do not update the count register (ctr) or link register (lr) are often removed from the instruction stream. C 8-entry link register stack to predict the target address of branch conditional to link register ( bclr ) instructions. four integer units (ius) that share 32 gprs for integer operands C three identical ius (iu1a, iu1b, and iu1c) can execute all integer instructions except multiply, divide, and move to/from special-purpose register instructions. C iu2 executes miscellaneous instructions including the cr logical operations, integer multiplication and division instructions, and move to/from special-purpose register instructions. five-stage fpu and a 32-entry fpr file C fully ieee 754-1985-compliant fpu for both single- and double-precision operations C supports non-ieee mode for time-critical operations C hardware support for denormalized numbers C thirty-two 64-bit fprs for single- or double-precision operands four vector units and 32-entry vector register file (vrs) C vector permute unit (vpu)
4 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice features C vector integer unit 1 (viu1) handles short-latency altivec integer instructions, such as vector add instructions ( vaddsbs , vaddshs , and vaddsws , for example) C vector integer unit 2 (viu2) handles longer -latency altivec integer instructions, such as vector multiply add instructions ( vmhaddshs , vmhraddshs , and vmladduhm , for example). C vector floating-point unit (vfpu) three-stage load/store unit (lsu) C supports integer, floating-point and vector instruction load/store traffic C four-entry vector touch queue (vtq) supports all four architected altivec data stream operations C three-cycle gpr and altivec load latency (byte, half-word, word, vector) with 1-cycle throughput C four-cycle fpr load latency (single, double) with 1-cycle throughput C no additional delay for misaligned access within double-word boundary C dedicated adder calculates effective addresses (eas) C supports store gathering C performs alignment, normalization, and precision conversion for floating-point data C executes cache control and tlb instructions C performs alignment, zero padding, and sign extension for integer data C supports hits under misses (multiple outstanding misses) C supports both big- and little-endian modes, including misaligned little-endian accesses ? three issue queues fiq, viq, and giq can accept as many as one, two, and three instructions, respectively, in a cycle. instruction dispatch requires the following: instructions can be dispatched only from the three lowest iq entriesiq0, iq1, and iq2. a maximum of three instructions can be dispatched to the issue queues per clock cycle. space must be available in the cq for an instruction to dispatch (this includes instructions that are assigned a space in the cq but not in an issue queue). ? rename buffers 16 gpr rename buffers 16 fpr rename buffers 16 vr rename buffers ? dispatch unit the decode/dispatch stage fully decodes each instruction. ? completion unit the completion unit retires an instruction from the 16-entry completion queue (cq) when all instructions ahead of it have been completed, the instruction has finished execution, and no exceptions are pending. guarantees sequential programming model (precise exception model) monitors all dispatched instructions and retires them in order
motorola mpc7451 risc microprocessor hardware specifications 5 preliminarysubject to change without notice features tracks unresolved branches and flushes instructions after a mispredicted branch retires as many as three instructions per clock cycle ? separate on-chip l1 instruction and data caches (harvard architecture) 32-kbyte, eight-way set-associative instruction and data caches pseudo least-recently-used (plru) replacement algorithm 32-byte (eight-word) l1 cache block physically indexed/physical tags cache write-back or write-through operation programmable on a per-page or per-block basis instruction cache can provide four instructions per clock cycle; data cache can provide four words per clock cycle caches can be disabled in software caches can be locked in software mesi data cache coherency maintained in hardware separate copy of data cache tags for efficient snooping parity support on cache and tags no snooping of instruction cache except for icbi instruction data cache supports altivec lru and transient instructions critical double- and/or quad-word forwarding is performed as needed. critical quad-word forwarding is used for altivec loads and instruction fetches. other accesses use critical double-word forwarding. ? level 2 (l2) cache interface on-chip, 256-kbyte, 8-way set associative unified instruction and data cache fully pipelined to provide 32 bytes per clock cycle to the l1 caches a total 9-cycle load latency for an l1 data cache miss that hits in l2 pseudo least-recently-used (plru) replacement algorithm cache write-back or write-through operation programmable on a per-page or per-block basis 64-byte, two-sectored line size parity support on cache ? level 3 (l3) cache interface provides critical double-word forwarding to the requesting unit internal l3 cache controller and tags external data srams support for 1- and 2-mbyte l3 caches cache write-back or write-through operation programmable on a per-page or per-block basis 64-byte (1 m) or 128-byte (2 m) sectored line size private memory capability for half (1-mbyte minimum) or all of the l3 sram space supports msug2 dual data rate (ddr) synchronous burst srams, pb2 pipelined synchronous burst srams, and pipelined (register-register) late write synchronous burst srams
6 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice features supports parity on cache and tags configurable core-to-l3 frequency divisors 64-bit external l3 data bus sustains 64 bits per l3 clock cycle ? separate memory management units (mmus) for instructions and data 52-bit virtual address; 32- or 36-bit physical address address translation for 4-kbyte pages, variable-sized blocks, and 256-mbyte segments memory programmable as write-back/write-through, caching-inhibited/caching-allowed, and memory coherency enforced/memory coherency not enforced on a page or block basis separate ibats and dbats (four each) also defined as sprs separate instruction and data translation lookaside buffers (tlbs) C both tlbs are 128-entry, two-way set associative, and use lru replacement algorithm C tlbs are hardware- or software-reloadable (that is, on a tlb miss a page table search is performed in hardware or by system software) ? efficient data flow although the vr/lsu interface is 128 bits, the l1/l2/l3 bus interface allows up to 256 bits. the l1 data cache is fully pipelined to provide 128 bits/cycle to or from the vrs l2 cache is fully pipelined to provide 256 bits per processor clock cycle to the l1 cache. as many as 8 outstanding, out-of-order, cache misses are allowed between the l1 data cache and l2/l3 bus. as many as 16 out-of-order transactions can be present on the mpx bus store merging for multiple store misses to the same line. only coherency action taken (address-only) for store misses merged to all 32 bytes of a cache block (no data tenure needed). three-entry finished store queue and five-entry completed store queue between the lsu and the l1 data cache separate additional queues for efficient buffering of outbound data (such as cast outs and write through stores) from the l1 data cache and l2 cache ? multiprocessing support features include the following: hardware-enforced, mesi cache coherency protocols for data cache load/store with reservation instruction pair for atomic memory references, semaphores, and other multiprocessor operations ? power and thermal management 1.6-v processor core the following three power-saving modes are available to the system: C napinstruction fetching is halted. only those clocks for the time base, decrementer, and jtag logic remain running. the part goes into the doze state to snoop memory operations on the bus and then back to nap using a qreq /qack processor-system handshake protocol. C sleeppower consumption is further reduced by disabling bus snooping, leaving only the pll in a locked and running state. all internal functional units are disabled. C deep sleepwhen the part is in the sleep state, the system can disable the pll resulting.
motorola mpc7451 risc microprocessor hardware specifications 7 preliminarysubject to change without notice comparison with the mpc7400 the system can then disable the sysclk source for greater system power savings. power-on reset procedures for restarting and relocking the pll must be followed on exiting the deep sleep state. thermal management facility provides software-controllable thermal management. thermal management is performed through the use of three supervisor-level registers and an mpc7451-specific thermal management exception. instruction cache throttling provides control of instruction fetching to limit power consumption. ? performance monitor can be used to help debug system designs and improve software efficiency. ? in-system testability and debugging features through jtag boundary-scan capability ? testability lssd scan design ieee 1149.1 jtag interface array built-in self test (abist)factory test only ? reliability and serviceability parity checking on system bus and l3 cache bus parity checking on l1, l2, and l3 cache arrays 1.3 comparison with the mpc7400 table 1 compares the key features of the mpc7451 with the key features of the earlier mpc7400. to achieve a higher frequency, the number of logic levels per cycle is reduced. also, to achieve this higher frequency, the pipeline of the mpc7451 is extended (compared to the mpc7400), while maintaining the same level of performance as measured by the number of instructions executed per cycle (ipc). table 1. microarchitecture comparison microarchitectural specs mpc7451 mpc7400/mpc7410 basic pipeline functions logic inversions per cycle 18 28 pipeline stages up to execute 5 3 total pipeline stages (minimum) 7 4 pipeline maximum instruction throughput 3 + branch 2 + branch pipeline resources instruction buffer size 12 6 completion buffer size 16 8 renames (integer, float, vector) 16, 16, 16 6, 6, 6 maximum execution throughput sfx 3 2 vector 2 (any 2 of 4 units) 2 (permute/fixed) scalar floating-point 1 1
8 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice comparison with the mpc7400 out-of-order window size in execution queues sfx integer units 1 entry 3 queues 1 entry 2 queues vector units in order, 4 queues in order, 2 queues scalar floating-point unit in order in order branch processing resources prediction structures btic, bht, link stack btic, bht btic size, associativity 128-entry, 4-way 64-entry, 4-way bht size 2k-entry 512-entry link stack depth 8 none unresolved branches supported 3 2 branch taken penalty (btic hit) 1 0 minimum misprediction penalty 6 4 execution unit timings (latency-throughput) aligned load (integer, float, vector) 3-1, 4-1, 3-1 2-1, 2-1, 2-1 misaligned load (integer, float, vector) 4-2, 5-2, 4-2 3-2, 3-2, 3-2 l1 miss, l2 hit latency 6 (9) 9 (11) 1 sfx (add sub, shift, rot, cmp, logicals) 1-1 1-1 integer multiply (32 8, 32 16, 32 32) 3-1, 3-1, 4-2 2-1, 3-2, 5-4 scalar float 5-1 3-1 vsfx (vector simple) 1-1 1-1 vcfx (vector complex) 4-1 3-1 vfpu (vector float) 4-1 4-1 vper (vector permute) 2-1 1-1 mmus mmus (instruction and data) 128-entry, 2-way 128-entry, 2-way tablewalk mechanism hardware + software hardware l1 i cache/d cache features size 32k/32k 32k/32k associativity 8-way 8-way locking granularity/style 4-kbyte/way full cache parity on i cache word none parity on d cache byte none number of d cache misses (load/store) 5/1 8 (any combination) data stream touch engines 4 streams 4 streams on-chip cache features cache level l2 none (except l1) table 1. microarchitecture comparison (continued) microarchitectural specs mpc7451 mpc7400/mpc7410
motorola mpc7451 risc microprocessor hardware specifications 9 preliminarysubject to change without notice general parameters 1.4 general parameters the following list provides a summary of the general parameters of the mpc7451: technology 0.18 m cmos, six-layer metal die size 8.69 mm 12.17 mm (106 mm 2 ) transistor count 33 million logic design fully static packages mpc7451: surface mount 483 ceramic ball grid array (cbga) core power supply 1.6 v 50 mv dc nominal i/o power supply 1.8 v 5% dc or 2.5 v 5% dc or 1.5 v 5% dc (l3 interface only) size/associativity 256-kbyte/8-way n/a access width 256 bits n/a number of 32-byte sectors/line 2 n/a parity byte n/a off-chip cache support cache level l3 l2 on-chip tag logical size 1mb, 2mb 0.5mb, 1mb, 2mb associativity 8-way 2-way number of 32-byte sectors/line 2, 4 1, 2, 4 off-chip data sram support msug2 ddr, lw, pb2 lw, pb2, pb3 data path width 64 64 direct mapped sram sizes 1 mbyte, 2 mbytes 0.5 mbyte, 1 mbyte, 2mbytes parity byte byte 1 numbers in parentheses are for 2:1 sram. table 1. microarchitecture comparison (continued) microarchitectural specs mpc7451 mpc7400/mpc7410
10 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice electrical and thermal characteristics 1.5 electrical and thermal characteristics this section provides the ac and dc electrical specifications and thermal characteristics for the mpc7451. 1.5.1 dc electrical characteristics the tables in this section describe the mpc7451 dc electrical characteristics. table 2 provides the absolute maximum ratings. table 2. absolute maximum ratings 1 characteristic symbol maximum value unit notes core supply voltage v dd C0.3 to 1.95 v 4 pll supply voltage av dd C0.3 to 1.95 v 4 processor bus supply voltage bvsel = 0 ov dd C0.3 to 1.95 v 3, 6 bvsel = hreset or ov dd ov dd C0.3 to 2.7 v 3, 7 l3 bus supply voltage l3vsel = ?hreset gv dd C0.3 to 1.65 v 3, 8 l3vsel = 0 gv dd C0.3 to 1.95 v 3, 9 l3vsel = hreset or gv dd gv dd C0.3 to 2.7 v 3, 10 input voltage processor bus v in C0.3 to ov dd + 0.3 v 2, 5 l3 bus v in C0.3 to gv dd + 0.3 v 2, 5 jtag signals v in C0.3 to ov dd + 0.3 v storage temperature range t stg C55 to 150 c notes : 1. functional and tested operating conditions are given in table 4. absolute maximum ratings are stress ratings only, and functional operation at the maximums is not guaranteed. stresses beyond those listed may affect device reliability or cause permanent damage to the device. 2. caution : v in must not exceed ov dd or gv dd by more than 0.3 v at any time including during power-on reset. 3. caution : ov dd /gv dd must not exceed v dd /av dd by more than 2.0 v at any time including during power-on reset. 4. caution : v dd /av dd must not exceed ov dd /gv dd by more than 0.4 v at any time including during power-on reset. 5. v in may overshoot/undershoot to a voltage and for a maximum duration as shown in figure 2. 6. bvsel must be set to 0, such that the bus is in 1.8 v mode. 7. bvsel must be set to hreset or 1, such that the bus is in 2.5 v mode. 8. l3vsel must be set to ?hreset (inverse of hreset ), such that the bus is in 1.5 v mode. 9. l3vsel must be set to 0, such that the bus is in 1.8 v mode. 10. l3vsel must be set to hreset or 1, such that the bus is in 2.5 v mode.
motorola mpc7451 risc microprocessor hardware specifications 11 preliminarysubject to change without notice electrical and thermal characteristics figure 2 shows the undershoot and overshoot voltage on the mpc7451. figure 2. overshoot/undershoot voltage the mpc7451 provides several i/o voltages to support both compatibility with existing systems and migration to future systems. the mpc7451 core voltage must always be provided at nominal 1.6 v (see table 4 for actual recommended core voltage). voltage to the l3 i/os and processor interface i/os are provided through separate sets of supply pins and may be provided at the voltages shown in table 3. the input voltage threshold for each bus is selected by sampling the state of the voltage select pins at the negation of the signal hreset . the output voltage will swing from gnd to the maximum voltage applied to the ov dd or gv dd power pins. table 3. input threshold voltage setting bvsel signal processor bus input threshold is relative to: l3vsel signal l3 bus input threshold is relative to: notes 0 1.8 v 0 1.8 v 1, 4 ?hreset not available ?hreset 1.5 v 1, 3 hreset 2.5 v hreset 2.5 v 1, 2 1 2.5 v 1 2.5 v 1 notes: 1. caution: the input threshold selection must agree with the ov dd /gv dd voltages supplied. see notes in table 2. 2. to select the 2.5-v threshold option for the processor bus, bvsel should be tied to hreset so that the two signals change state together. similarly, to select 2.5 v for the l3 bus, tie l3vsel to hreset . this is the preferred method for selecting this mode of operation. 3. applicable to l3 bus interface only. ?hreset is the inverse of hreset . 4. if used, pulldown resistors should be less than 250 w . v ih gnd gnd C 0.3 v gnd C 0.7 v not to exceed 10% ov dd /gv dd + 20% v il ov dd /gv dd ov dd /gv dd + 5% of t sysclk
12 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice electrical and thermal characteristics table 4 provides the recommended operating conditions for the mpc7451. table 5 provides the package thermal characteristics for the mpc7451. table 4. recommended 1 operating conditions characteristic symbol recommended value unit notes min max core supply voltage v dd 1.6 v 50 mv v pll supply voltage av dd 1.6 v 50 mv v 2 processor bus supply voltage bvsel = 0 ov dd 1.8 v 5% v bvsel = hreset or ov dd ov dd 2.5 v 5% v l3 bus supply voltage l3vsel = 0 gv dd 1.8 v 5% v l3vsel = hreset or gv dd gv dd 2.5 v 5% v l3vsel = ?hreset gv dd 1.5 v 5% v input voltage processor bus v in gnd ov dd v l3 bus v in gnd gv dd v jtag signals v in gnd ov dd v die-junction temperature t j 0105c notes: 1. these are the recommended and tested operating conditions. proper device operation outside of these conditions is not guaranteed. 2. this voltage is the input to the filter discussed in section 1.9.2, pll power supply filtering and not necessarily the voltage at the av dd pin which may be reduced from v dd by the filter. table 5. package thermal characteristics characteristic symbol value rating cbga package thermal resistance, junction-to-case thermal resistance (typical) q jc <0.1 c/w cbga package thermal resistance, die junction-to-lead thermal resistance (typical) q jb 2.2 c/w note: refer to section 1.9, system design information, for more details about thermal management.
motorola mpc7451 risc microprocessor hardware specifications 13 preliminarysubject to change without notice electrical and thermal characteristics table 6 provides the dc electrical characteristics for the mpc7451. table 6. dc electrical specifications at recommended operating conditions. see table 4. characteristic nominal bus voltage 1 symbol min max unit notes input high voltage (all inputs except sysclk) 1.5 v ih gv dd 0.65 gv dd + 0.3 v 6 1.8 v ih ov dd /gv dd 0.65 ov dd /gv dd + 0.3 v 2.5 v ih 1.7 ov dd /gv dd + 0.3 v input low voltage (all inputs except sysclk) 1.5 v il C0.3 gv dd 0.35 v 6 1.8 v il C0.3 ov dd /gv dd 0.35 v 2.5 v il C0.3 0.7 v sysclk input high voltage cv ih 1.4 ov dd + 0.3 v sysclk input low voltage cv il C0.3 0.4 v input leakage current, v in = gv dd /ov dd + 0.3 v i in 10a2, 3 high impedance (off-state) leakage current, v in = gv dd /ov dd + 0.3 v i tsi 10a2, 3, 5 output high voltage, i oh = C5 ma 1.5 v oh ov dd /gv dd C 0.45 v 6 1.8 v oh ov dd /gv dd C 0.45 v 2.5 v oh 1.7 v output low voltage, i ol = 5 ma 1.5 v ol 0.45v6 1.8 v ol 0.45v 2.5 v ol 0.7v capacitance, v in = 0 v, f = 1 mhz l3 interface c in 9.5pf4 all other inputs 8.0 pf 4 notes: 1. nominal voltages; see table 4 for recommended operating conditions. 2. for processor bus signals, the reference is ov dd while gv dd is the reference for the l3 bus signals. 3. excludes test signals and ieee 1149.1 boundary scan (jtag) signals. 4. capacitance is periodically sampled rather than 100% tested. 5. the leakage is measured for nominal ov dd /gv dd and v dd , or both ov dd /gv dd and v dd must vary in the same direction (for example, both ov dd and v dd vary by either +5% or C5%). 6. applicable to l3 bus interface only.
14 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice electrical and thermal characteristics table 7 provides the power consumption for the mpc7451. 1.5.2 ac electrical characteristics this section provides the ac electrical characteristics for the mpc7451. after fabrication, functional parts are sorted by maximum processor core frequency as shown in section 1.5.2.1, clock ac specifications, and tested for conformance to the ac specifications for that frequency. the processor core frequency is determined by the bus (sysclk) frequency and the settings of the pll_ext and pll_cfg[0:3] signals. parts are sold by maximum processor core frequency; see section 1.11, ordering information. 1.5.2.1 clock ac specifications table 8 provides the clock ac timing specifications as defined in figure 3. table 7. power consumption for mpc7451 processor (cpu) frequency unit notes 600 mhz 667 mhz full-power mode typical 13.0 14.5 w 1, 3 maximum 17.5 19.0 w 1, 2 doze mode typical w1, 3, 4 nap mode typical 1.4 1.7 w 1, 3 sleep mode typical 0.7 0.8 w 1, 3 deep sleep mode (pll disabled) typical 460 510 mw 1, 3 notes: 1. these values apply for all valid processor bus and l3 bus ratios. the values do not include i/o supply power (ov dd and gv dd ) or pll supply power (av dd ). ov dd and gv dd power is system dependent, but is typically <20% of v dd power. worst case power consumption for av dd < 3 mw. 2. maximum power is measured at nominal v dd (see table 4) while running an entirely cache-resident, contrived sequence of instructions which keep the execution units, with or without altivec, maximally busy. 3. typical power is an average value measured at the nominal recommended v dd (see table 4) in a system while running a typical code sequence. 4. doze mode is not a user-definable state; it is an intermediate state between full-power and either nap or sleep mode. as a result, power consumption for this mode is not tested.
motorola mpc7451 risc microprocessor hardware specifications 15 preliminarysubject to change without notice electrical and thermal characteristics figure 3 provides the sysclk input timing diagram. figure 3. sysclk input timing diagram 1.5.2.2 processor bus ac specifications table 9 provides the processor bus ac timing specifications for the mpc7451 as defined in figure 4 and figure 5. timing specifications for the l3 bus are provided in section 1.5.2.3, l3 clock ac specifications. table 8. clock ac timing specifications at recommended operating conditions. see table 4. characteristic symbol maximum processor core frequency unit notes 600 mhz 667 mhz min max min max processor frequency f core 500 600 500 667 mhz 1 vco frequency f vco 1000 1200 1000 1333 mhz 1 sysclk frequency f sysclk 33 133 33 133 mhz 1 sysclk cycle time t sysclk 7.5307.530ns sysclk rise and fall time t kr and t kf 1.01.0ns2 sysclk duty cycle measured at ov dd /2 t khkl /t sysclk 40 60 40 60 % 3 sysclk jitter 150 150 ps 4, 6 internal pll relock time 100 100 m s5 notes : 1. caution : the sysclk frequency, pll_ext and pll_cfg[0:3] settings must be chosen such that the resulting sysclk (bus) frequency, cpu (core) frequency, and pll (vco) frequency do not exceed their respective maximum or minimum operating frequencies. refer to the pll_ext, pll_cfg[0:3] signal description in section 1.9.1, pll configuration, for valid pll_ext and pll_cfg[0:3] settings. 2. rise and fall times for the sysclk input measured from 0.4 v to 1.4 v. 3. timing is guaranteed by design and characterization. 4. this represents total input jittershort term and long term combinedand is guaranteed by design. 5. relock timing is guaranteed by design and characterization. pll-relock time is the maximum amount of time required for pll lock after a stable v dd and sysclk are reached during the power-on reset sequence. this specification also applies when the pll has been disabled and subsequently re-enabled during sleep mode. also note that hreset must be held asserted for a minimum of 255 bus clocks after the pll-relock time during the power-on reset sequence. 6. the sysclk drivers closed loop jitter bandwidth should be <500 khz at C20 db. the bandwidth must be set low to allow cascade connected pll-based devices to track sysclk drivers with the specified jitter. sysclk vm vm vm cv ih cv il vm = midpoint voltage (ov dd /2) t sysclk t kr t kf t khkl
16 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice electrical and thermal characteristics table 9. processor bus ac timing specifications at recommended operating conditions. see table 4. parameter symbol 2 all speed grades unit notes min max mode select input setup to hreset t mvrh 8 t sysclk 3, 4, 5, 6 hreset to mode select input hold t mxrh 0 ns 3, 5 input setup times: a[0:35], ap[0:4], gbl , tbst , tsiz[0:2], wt , ci , d[0:63], dp[0:7] aack , artry , bg , ckstp_in , dbg , dti[0:3], hreset , int , mcp , qack , smi , sreset , ta , tben, tea , ts , ext_qual, pmon_in , shd [0:1] t avkh t ivkh 2.0 2.0 ns input hold times: a[0:35], ap[0:4], gbl , tbst , tsiz[0:2], wt , ci , d[0:63], dp[0:7] aack , artry , bg , ckstp_in , dbg , dti[0:3], hreset , int , mcp , qack , smi , sreset , ta , tben, tea , ts , ext_qual, pmon_in , shd [0:1] t axkh t ixkh 0 0 ns output valid times: a[0:35], ap[0:4], gbl , tbst , tsiz[0:2], wt , ci ts d[0:63], dp[0:7] artry /shd0 /shd1 br , ckstp_out , drdy , hit , pmon_out , qreq ] t khav t khtsv t khdv t kharv t khov 2.5 2.5 2.5 2.5 2.5 ns output hold times: a[0:35], ap[0:4], gbl , tbst , tsiz[0:2], wt , ci ts d[0:63], dp[0:7] artry /shd0 /shd1 br , ckstp_out , drdy , hit , pmon_out , qreq t khax t khtsx t khdx t kharx t khox 0.5 0.5 0.5 0.5 0.5 ns sysclk to output enable t khoe 0.5 ns sysclk to output high impedance (all except ts , artry , shd0 , shd1 ) t khoz 3.5ns sysclk to ts high impedance after precharge t khtspz 1t sysclk 5, 7, 10 maximum delay to artry /shd0 /shd1 precharge t kharp 1t sysclk 5, 8, 9, 10
motorola mpc7451 risc microprocessor hardware specifications 17 preliminarysubject to change without notice electrical and thermal characteristics figure 4 provides the ac test load for the mpc7451. figure 4. ac test load sysclk to artry /shd0 /shd1 high impedance after precharge t kharpz 2t sysclk 5, 8, 9, 10 notes: 1. all input specifications are measured from the midpoint of the signal in question to the midpoint of the rising edge of the input sysclk. all output specifications are measured from the midpoint of the rising edge of sysclk to the midpoint of the signal in question. all output timings assume a purely resistive 50- w load (see figure 4). input and output timings are measured at the pin; time-of-flight delays must be added for trace lengths, vias, and connectors in the system. 2. the symbology used for timing specifications herein follows the pattern of t (signal)(state)(reference)(state) for inputs and t (reference)(state)(signal)(state) for outputs. for example, t ivkh symbolizes the time input signals (i) reach the valid state (v) relative to the sysclk reference (k) going to the high (h) state or input setup time. and t khov symbolizes the time from sysclk(k) going high (h) until outputs (o) are valid (v) or output valid time. input hold time can be read as the time that the input signal (i) went invalid (x) with respect to the rising clock edge (kh) (note the position of the reference and its state for inputs) and output hold time can be read as the time from the rising edge (kh) until the output went invalid (ox). 3. the setup and hold time is with respect to the rising edge of hreset (see figure 5). 4. this specification is for configuration mode select only. 5. t sysclk is the period of the external clock (sysclk) in nanoseconds (ns). the numbers given in the table must be multiplied by the period of sysclk to compute the actual time duration (in ns) of the parameter in question. 6. mode select signals are: bvsel, l3vsel, pll_cfg[0:3], pll_ext, bmode[0:1]. 7. according to the bus protocol, ts is driven only by the currently active bus master. it is asserted low then precharged high before returning to high impedance as shown in figure 6. the nominal precharge width for ts is 0.5 t sysclk , i.e., less than the minimum t sysclk period, to ensure that another master asserting ts on the following clock will not contend with the precharge. output valid and output hold timing is tested for the signal asserted. output valid time is tested for precharge.the high impedance behavior is guaranteed by design. 8. according to the bus protocol, artry can be driven by multiple bus masters through the clock period immediately following aack . bus contention is not an issue because any master asserting artry will be driving it low. any master asserting it low in the first clock following aack will then go to high impedance for one clock before precharging it high during the second cycle after the assertion of aack . the nominal precharge width for artry is 1.0 t sysclk ; that is, it should be high impedance as shown in figure 6 before the first opportunity for another master to assert artry . output valid and output hold timing is tested for the signal asserted.the high-impedance behavior is guaranteed by design. 9. according to the mpx bus protocol, shd0 and shd1 can be driven by multiple bus masters beginning the cycle of ts . timing is the same as artry , i.e., the signal is high impedance for a fraction of a cycle, then negated for up to an entire cycle (crossing a bus cycle boundary) before being three-stated again. the nominal precharge width for shd0 and shd1 is 1.0 t sysclk . the edges of the precharge vary depending on the programmed ratio of core to bus (pll configurations). 10. guaranteed by design and not tested. table 9. processor bus ac timing specifications (continued) at recommended operating conditions. see table 4. parameter symbol 2 all speed grades unit notes min max output z 0 = 50 w ov dd /2 r l = 50 w
18 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice electrical and thermal characteristics figure 5 provides the mode select input timing diagram for the mpc7451. figure 5. mode input timing diagram figure 6 provides the input/output timing diagram for the mpc7451. figure 6. input/output timing diagram hreset mode signals t mvrh t mxrh vm = midpoint voltage (ov dd /2) vm sysclk all inputs vm vm = midpoint voltage (ov dd /2) all outputs t khox vm t khdv (except ts , artry , shd0 , shd1 ) all outputs ts artry , (except ts , artry , shd0 , shd1 ) vm t khoe t khoz t khtspz t kharpz t kharp shd1 shd0 , t khov t khav t khdx t khax t ixkh t axkh t khtsx t khtsv t khtsv t kharv t kharx t ivkh t avkh
motorola mpc7451 risc microprocessor hardware specifications 19 preliminarysubject to change without notice electrical and thermal characteristics 1.5.2.3 l3 clock ac specifications the l3_clk frequency is programmed by the l3 configuration register (l3cr[6:8]) core-to-l3 divisor ratio. see table 17 for example core and l3 frequencies at various divisors. table 10 provides the potential range of l3_clk output ac timing specifications as defined in figure 7. the maximum l3_clk frequency is the core frequency divided by two. however, very few sram designs will be able to operate in this mode and most designs will select a greater core-to-l3 divisor to provide a longer l3_clk period for read and write access to the l3 srams. therefore, the maximum l3_clk frequency shown in table 10 is considered to be the practical maximum in a typical system. the maximum l3_clk frequency for any application of the mpc7451 will be a function of the ac timings of the mpc7451, the ac timings for the sram, bus loading, and printed circuit board trace length. motorola is similarly limited by system constraints and cannot perform tests of the l3 interface on a socketed part on a functional tester at the maximum frequencies of table 10. therefore, functional operation and ac timing information are tested at core-to-l3 divisors which result in l3 frequencies at 200 mhz or less. notes : 1. the maximum l3 clock frequency will be system dependent. see section 1.5.2.3, l3 clock ac specifications for an explanation that this maximum frequency is not functionally tested at speed by motorola. 2. the nominal duty cycle of the l3 output clocks is 50% measured at midpoint voltage. 3. maximum possible skew between l3_clk0 and l3_clk1. this parameter is critical to the address and control signals which are common to both sram chips in the l3. 4. maximum possible skew between l3_clk0 and l3_echo_clk1 or between l3_clk1 and l3_echo_clk3 for pb2 or late write sram. this parameter is critical to the write data signals which are separately latched onto each sram part by these pairs of signals. 5. guaranteed by design and not tested. the input jitter on sysclk affects l3 output clocks and the l3 address/data/ control signals equally and, therefore, is already comprehended in the ac timing and does not have to be considered in the l3 timing analysis. the clock-to-clock jitter shown here is uncertainty in the internal clock period caused by supply voltage noise or thermal effects. this must be accounted for, along with clock skew, in any l3 timing analysis. table 10. l3_clk output ac timing specifications at recommended operating conditions. see table 4. parameter symbol all speed grades unit notes min max l3 clock frequency f l3_clk 75 266 mhz 1 l3 clock cycle time t l3_clk 3.75 13.3 ns l3 clock duty cycle t chcl /t l3_clk 50 % 2 l3 clock output-to-output skew (l1_clk0 to l1_clk1) t l3cskw1 200 ps 3 l3 clock output-to-output skew (l1_clk[0:1] to l1_echo_clk[1:3]) t l3cskw2 100 ps 4 l3 clock jitter 50 ps 5
20 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice electrical and thermal characteristics the l3_clk timing diagram is shown in figure 7. . figure 7. l3_clk_out output timing diagram 1.5.2.4 l3 bus ac specifications the mpc7451 l3 interface supports three different types of sram: source-synchronous, double data rate (ddr) msug2 sram, late write srams, and pipeline burst (pb2) srams. each requires a different protocol on the l3 interface and a different routing of the l3 clock signals. the type of sram is programmed in l3cr[22:23] and the mpc7451 then follows the appropriate protocol for that type. the designer must connect and route the l3 signals appropriately for each type of sram. following are some observations about the chip-to-sram interface. ? the routing for the point-to-point signals (l3_clk[0:1], l3data[0:63], l3dp[0:7], and l3_echo_clk[0:3]) to a particular sram must be delay matched. ? for a 1-mbyte l3, use address bits 0:16 (bit 0 is lsb). ? no pull-up resistors are required for the l3 interface. ? for high speed operations, l3 interface address and control signals should be a t with minimal stubs to the two loads; data and clock signals should be point-to-point to their single load. figure 8 shows the ac test load for the l3 interface. figure 8. ac test load for the l3 interface in general, if routing is short, delay-matched, and designed for incident wave reception and minimal reflection, there is a high probability that the ac timing of the mpc7451 l3 interface will meet the maximum frequency operation of appropriately chosen srams. this is despite the pessimistic, guard-banded ac specifications (see table 12, table 13, and table 14), the limitations of functional testers described in section 1.5.2.3, l3 clock ac specifications, and the uncertainty of clocks and signals which inevitably make worst-case critical path timing analysis pessimistic. l3_clk0 vm t l3cr t l3cf vm vm vm l3_clk1 vm vm t l3_clk t chcl vm t l3cskw1 l3_echo_clk1 l3_echo_clk3 vm vm vm vm t l3cskw2 vm vm vm vm t l3cskw2 for pb2 or late write: output z 0 = 50 w ov dd /2 r l = 50 w
motorola mpc7451 risc microprocessor hardware specifications 21 preliminarysubject to change without notice electrical and thermal characteristics more specifically, certain signals within groups should be delay-matched with others in the same group while intergroup routing is less critical. only the address and control signals are common to both srams and additional timing margin is available for these signals. the double-clocked data signals are grouped with individual clocks as shown in figure 9 or figure 11, depending on the type of sram. for example, for the msug2 ddr sram (see figure 9); l3data[0:31], l3dp[0:3], and l3_clk[0] form a closely coupled group of outputs from the mpc7451; while l3data[0:15], l3dp[0:1], and l3_echo_clk[0] form a closely coupled group of inputs. the mpc7450 risc microprocessor family users manual refers to logical settings called sample points used in the synchronization of reads from the receive fifo. the computation of the correct value for this setting is system-dependent and is described in the mpc7450 risc microprocessor family users manual . three specifications are used in this calculation and are given in table 11. it is essential that all three specifications are included in the calculations to determine the sample points, as incorrect settings can result in errors and unpredictable behavior. for more information, see the mpc7450 risc microprocessor family users manual. 1.5.2.4.1 l3 bus ac specifications for ddr msug2 srams when using ddr msug2 srams at the l3 interface, the parts should be connected as shown in figure 9. outputs from the mpc7451 are actually launched on the edges of an internal clock phase-aligned to sysclk (adjusted for core and l3 frequency divisors). l3_clk0 and l3_clk1 are this internal clock output with 90 phase delay, so outputs are shown synchronous to l3_clk0 and l3_clk1. output valid times are typically negative when referenced to l3_clk n because the data is launched one-quarter period before l3_clk n to provide adequate setup time at the sram after the delay-matched address, control, data, and l3_clk n signals have propagated across the printed wiring board. inputs to the mpc7451 are source-synchronous with the cq clock generated by the ddr msug2 srams. these cq clocks are received on the l3_echo_clk n inputs of the mpc7451. an internal circuit delays the incoming l3_echo_clk n signal such that it is positioned within the valid data window at the internal receiving latches. this delayed clock is used to capture the data into these latches which comprise the receive fifo. this clock is asynchronous to all other processor clocks. this latched data is subsequently read out of the fifo synchronously to the processor clock. the time between writing and reading the data is set by the using the sample point settings defined in the l3cr register. table 11. sample points calculation parameters parameter symbol max unit notes delay from processor clock to internal_l3_clk t ac 3/4 t l3_clk 1 delay from internal_l3_clk to l3_clk[ n ] output pins t co 3ns2 delay from l3_echo_clk[ n ] to receive latch t eci 3ns3 notes : 1. this specification describes a logical offset between the internal clock edge used to launch the l3 address and control signals (this clock edge is phase-aligned with the processor clock edge) and the internal clock edge used to launch the l3_clk[ n ] signals. with proper board routing, this offset ensures that the l3_clk[ n ] edge will arrive at the sram within a valid address window and provide adequate setup and hold time. this offset is reflected in the l3 bus interface ac timing specifications, but must also be separately accounted for in the calculation of sample points and, thus, is specified here. 2. this specification is the delay from a rising or falling edge on the internal_l3_clk signal to the corresponding rising or falling edge at the l3clk[ n ] pins. 3. this specification is the delay from a rising or falling edge of l3_echo_clk[ n ] to data valid and ready to be sampled from the fifo.
22 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice electrical and thermal characteristics table 12 provides the l3 bus interface ac timing specifications for the configuration as shown in figure 9, assuming the timing relationships shown in figure 10 and the loading shown in figure 8. table 12. l3 bus interface ac timing specifications for msug2 at recommended operating conditions. see table 4. parameter symbol all speed grades unit notes min max l3_clk rise and fall time t l3cr and t l3cf 1.0ns1 setup times:data and parity t l3dveh and t l3dvel C(t l3_echo_clk /4 C 0.35) ns2, 3, 4 input hold times:data and parity t l3dxeh and t l3dxel t l3_echo_clk /4 + 0.35 ns2, 4 valid times:data and parity all other outputs t l3chdv and t l3cldv t l3chov Ct l3_clk /4 + 0.5 t l3_clk /4 + 1.0 ns 5, 6, 7 5, 7 output hold times: data and parity all other outputs t l3chdx and t l3cldx t l3chox t l3_clk /4 C 0.35 t l3_clk /4 + 0.5 ns 5, 6, 7 5, 7 l3_clk to high impedance: data and parity all other outputs t l3cldz t l3choz t l3_clk /2 t l3_clk /4 + 2.0 ns notes : 1. rise and fall times for the l3_clk output are measured from 20% to 80% of gv dd . 2. for ddr, all input specifications are measured from the midpoint of the signal in question to the midpoint voltage of the rising or falling edge of the input l3_echo_clk n (see figure 10). input timings are measured at the pins. 3. for ddr, the input data will typically follow the edge of l3_echo_clk n as shown in figure 10. for consistency with other input setup time specifications, this will be treated as negative input setup time. 4. t l3_echo_clk /4 is one-fourth the period of l3_echo_clk n . this parameter indicates that the mpc7451 can latch an input signal that is valid for only a short time before and a short time after the midpoint between the rising and falling (or falling and rising) edges of l3_echo_clk n at any frequency. 5. all output specifications are measured from the midpoint voltage of the rising (or for ddr write data, also the falling) edge of l3_clk to the midpoint of the signal in question. the output timings are measured at the pins. all output timings assume a purely resistive 50- w load (see figure 8). 6. for ddr, the output data will typically lead the edge of l3_clk n as shown in figure 10. for consistency with other output valid time specifications, this will be treated as negative output valid time. 7. t l3_clk /4 is one-fourth the period of l3_clk n . this parameter indicates that the specified output signal is actually launched by an internal clock delayed in phase by 90. therefore, there is a frequency component to the output valid and output hold times such that the specified output signal will be valid for approximately one l3_clk period starting three-fourths of a clock prior to the edge on which the sram will sample it and ending one-fourth of a clock period after the edge it will be sampled.
motorola mpc7451 risc microprocessor hardware specifications 23 preliminarysubject to change without notice electrical and thermal characteristics figure 9 shows the typical connection diagram for the mpc7451 interfaced to msug2 srams such as the motorola mcm64e836. figure 9. typical source synchronous 2-mbyte l3 cache ddr interface {l3data[0:15], {l3data[16:31], {l3_data[32:47], l3addr[0:17] l3_cntl [0] l3_clk[0] l3_clk[1] l3_echo_clk[0] l3_echo_clk[1] l3echo_clk[2] l3_echo_clk[3] {l3data[48:63], l3dp[0:1]} l3dp[2:3]} l3dp[4:5]} l3dp[6:7]} cq sa[0:17] ck b1 b2 sram 0 sram 1 cq d[0:17] d[18:35] cq sa[0:17] ck b1 b2 cq d[0:17] d[18:35] l3_cntl [1] nc nc gnd gnd gnd nc nc gnd gnd gnd mpc7451 denotes receive (sram to mpc7451) aligned signals denotes transmit (mpc7451 to sram) aligned signals gv dd /2 gv dd /2 cq ck b3 g cq lbo cq ck b3 g cq lbo
24 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice electrical and thermal characteristics figure 10 shows the l3 bus timing diagrams for the mpc7451 interfaced to msug2 srams. figure 10. l3 bus timing diagrams for l3 cache ddr srams 1.5.2.4.2 l3 bus ac specifications for pb2 and late write srams when using pb2 or late write srams at the l3 interface, the parts should be connected as shown in figure 11. these srams are synchronous to the mpc7451; one l3_clk n signal is output to each sram to latch address, control, and write data. read data is launched by the sram synchronous to the delayed l3_clk n signal it received. the mpc7451 needs a copy of that delayed clock which launched the sram read data to know when the returning data will be valid. therefore, l3_echo_clk1 and l3_echo_clk3 must be routed halfway to the srams and then returned to the mpc7451 inputs l3_echo_clk0 and l3_echo_clk2 respectively. thus, l3_echo_clk0 and l3_echo_clk2 are phase-aligned with the input clock received at the srams. the mpc7451 will latch the incoming data on the rising edge of l3_echo_clk0 and l3_echo_clk2. table 13 provides the l3 bus interface ac timing specifications for the configuration shown in figure 11, assuming the timing relationships of figure 12 and the loading of figure 8. l3_echo_clk[0,1,2,3] l3 data and data vm vm = midpoint voltage (gv dd /2) parity inputs l3_clk[0,1] addr, l3cntl vm t l3chov t l3chox vm l3data write t l3choz vm vm vm vm t l3chdv t l3chdx vm vm vm outputs inputs t l3cldv t l3cldx t l3cldz t l3dveh t l3dxel t l3dvel t l3dxeh note: t l3dveh and t l3dvel as drawn here will be negative numbers, i.e., input setup time will be time after the clock edge. note: t l3chdv and t l3cldv as drawn here will be negative numbers, i.e., output valid time will be time before the clock edge.
motorola mpc7451 risc microprocessor hardware specifications 25 preliminarysubject to change without notice electrical and thermal characteristics table 13. l3 bus interface ac timing specifications for pb2 and late write srams at recommended operating conditions. see table 4. parameter symbol all speed grades unit notes min max l3_clk rise and fall time t l3cr and t l3cf 1.0 ns 1, 5 setup times:data and parity t l3dveh 1.5 ns 2, 5 input hold times:data and parity t l3dxeh 0.5 ns 2, 5 valid times:data and parity all other outputs t l3chdv t l3chov t l3_clk /4 + 1.0 t l3_clk /4 + 1.0 ns 3, 4, 5 4 output hold times:data and parity all other outputs t l3chdx t l3chox t l3_clk /4 + 0.5 t l3_clk /4 + 0.5 ns 3, 4, 5 4, 5 l3_clk to high impedance:data and parity all other outputs t l3chdz t l3choz 2.0 2.0 ns 5 5 notes : 1. rise and fall times for the l3_clk output are measured from 20% to 80% of gv dd . 2. all input specifications are measured from the midpoint of the signal in question to the midpoint voltage of the rising edge of the input l3_echo_clk n (see figure 10). input timings are measured at the pins. 3. all output specifications are measured from the midpoint voltage of the rising edge of l3_clk n to the midpoint of the signal in question. the output timings are measured at the pins. all output timings assume a purely resistive 50- w load (see figure 10). 4. t l3_clk /4 is one-fourth the period of l3_clk n . this parameter indicates that the specified output signal is actually launched by an internal clock delayed in phase by 90. therefore, there is a frequency component to the output valid and output hold times such that the specified output signal will be valid for approximately one l3_clk period starting three-fourths of a clock prior to the edge on which the sram will sample it and ending one-fourth of a clock period after the edge it will be sampled. 5. timing behavior and characterization are currently being evaluated.
26 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice electrical and thermal characteristics figure 11 shows the typical connection diagram for the mpc7451 interfaced to pb2 srams, such as the motorola mcm63r737, or late write srams, such as the motorola mcm63r836a. figure 11. typical synchronous 1-mbyte l3 cache late write or pb2 interface l3_addr[0:17] l3_cntl [0] sa[0:17] k k ss sw , zz g sram 0 dq[0:17] dq[18:36 ] l3_cntl [1] gv dd /2 gnd gnd sbwa , sbwb , sbwc , sbwd sram 1 gv dd /2 gnd gnd {l3_data[0:15], {l3_data[16:31], {l3_data[32:47], l3_clk[0] l3_clk[1] l3_echo_clk[0] l3_echo_clk[1] l3_echo_clk[2] {l3_data[48:63], l3_dp[0:1]} l3_dp[2:3]} l3_dp[4:5]} l3_dp[6:7]} denotes receive (sram to mpc7451) aligned signals mpc7451 denotes transmit (mpc7451 to sram) aligned signals l3_echo_clk[3] sa[0:17] k k ss sw , zz g dq[0:17] dq[18:36 ] sbwa , sbwb , sbwc , sbwd
motorola mpc7451 risc microprocessor hardware specifications 27 preliminarysubject to change without notice electrical and thermal characteristics figure 12 shows the l3 bus timing diagrams for the mpc7451 interfaced to pb2 or late write srams. figure 12. l3 bus timing diagrams for late write or pb2 srams 1.5.2.5 ieee 1149.1 ac timing specifications table 14 provides the ieee 1149.1 (jtag) ac timing specifications as defined in figure 14, figure 15, figure 16, and figure 17. table 14. jtag ac timing specifications (independent of sysclk) 1 at recommended operating conditions. see table 4. parameter symbol min max unit notes tck frequency of operation f tclk 033.3mhz tck cycle time t tclk 30 ns tck clock pulse width measured at 1.4 v t jhjl 15 ns tck rise and fall times t jr and t jf 02ns trst assert time t trst 25 ns 2 input setup times: boundary-scan data tms, tdi t dvjh t ivjh 4 0 ns 3 input hold times: boundary-scan data tms, tdi t dxjh t ixjh 20 25 ns 3 l3_echo_clk[0,2] l3 data and data vm vm = midpoint voltage (gv dd /2) t l3dveh t l3dxeh parity inputs l3_clk[0,1] addr, l3_cntl vm t l3chov t l3chox vm l3data write t l3chdz outputs inputs l3_echo_clk[1,3] t l3chdv t l3chdx t l3choz
28 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice electrical and thermal characteristics figure 13 provides the ac test load for tdo and the boundary-scan outputs of the mpc7451. figure 13. alternate ac test load for the jtag interface figure 14 provides the jtag clock input timing diagram. figure 14. jtag clock input timing diagram figure 15 provides the trst timing diagram. figure 15. trst timing diagram valid times: boundary-scan data tdo t jldv t jlov 4 4 20 25 ns 4 output hold times: boundary-scan data tdo t jldx t jlox tbd tbd tbd tbd ns 4 tck to output high impedance: boundary-scan data tdo t jldz t jloz 3 3 19 9 ns 4, 5 5 notes: 1. all outputs are measured from the midpoint voltage of the falling/rising edge of tclk to the midpoint of the signal in question. the output timings are measured at the pins. all output timings assume a purely resistive 50- w load (see figure 13). time-of-flight delays must be added for trace lengths, vias, and connectors in the system. 2. trst is an asynchronous level sensitive signal. the setup time is for test purposes only. 3. non-jtag signal input timing with respect to tck. 4. non-jtag signal output timing with respect to tck. 5. guaranteed by design and characterization. table 14. jtag ac timing specifications (independent of sysclk) 1 (continued) at recommended operating conditions. see table 4. parameter symbol min max unit notes output z 0 = 50 w ov dd /2 r l = 50 w tclk vm vm vm vm = midpoint voltage (ov dd /2) t tclk t jr t jf t jhjl trst t trst vm = midpoint voltage (ov dd /2) vm vm
motorola mpc7451 risc microprocessor hardware specifications 29 preliminarysubject to change without notice electrical and thermal characteristics figure 16 provides the boundary-scan timing diagram. figure 16. boundary-scan timing diagram figure 17 provides the test access port timing diagram. figure 17. test access port timing diagram vm tck boundary boundary boundary data outputs data inputs data outputs vm = midpoint voltage (ov dd /2) t dxjh t dvjh t jldv t jldz input data valid output data valid output data valid t jldx vm vm tck tdi, tms tdo output data valid vm = midpoint voltage (ov dd /2) t ixjh t ivjh t jlov t jloz input data valid tdo output data valid t jlox vm
30 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice pin assignments 1.6 pin assignments figure 18 (in part a) shows the pinout of the mpc7451, 483 cbga package as viewed from the top surface. part b shows the side profile of the cbga package to indicate the direction of the top surface view. part a figure 18. pinout of the mpc7451, 483 cbga package as viewed from the top surface a b c d e f g h j k l m n p r t 12 3 4 5678 910111213141516 not to scale 17 18 19 u v w 20 21 22 y aa ab view part b die substrate assembly encapsulant
motorola mpc7451 risc microprocessor hardware specifications 31 preliminarysubject to change without notice pinout listings for the 483 cbga package 1.7 pinout listings for the 483 cbga package table 15 provides the pinout listing for the mpc7451, 483 cbga package. table 15. pinout listing for the mpc7451, 483 cbga package signal name pin number active i/o i/f select 1 notes a[0:35] e10, n4, e8, n5, c8, r2, a7, m2, a6, m1, a10, u2, n2, p8, m8, w4, n6, u6, r5, y4, p1, p4, r6, m7, n7, aa3, u4, w2, w1, w3, v4, aa1, d10, j4, g10, d9 high i/o bvsel 11 aack u1 low input bvsel ap[0:4] l5, l6, j1, h2, g5 high i/o bvsel artry t2 low i/o bvsel 8 av dd b2 input n/a bg r3 low input bvsel bmode0 c6 low input bvsel 5 bmode1 c4 low input bvsel 6 br k1 low output bvsel bvsel g6 high input n/a 3, 7 ci r1 low output bvsel 8 ckstp_in f3 low input bvsel ckstp_out k6 low output bvsel clk_out n1 high output bvsel d[0:63] ab15, t14, r14, ab13, v14, u14, ab14, w16, aa11, y11, u12, w13, y14, u13, t12, w12, ab12, r12, aa13, ab11, y12, v11, t11, r11, w10, t10, w11, v10, r10, u10, aa10, u9, v7, t8, ab4, y6, ab7, aa6, y8, aa7, w8, ab10, aa16, ab16, ab17, y18, ab18, y16, aa18, w14, r13, w15, aa14, v16, w6, aa12, v6, ab9, ab6, r7, r9, aa9, ab8, w9 high i/o bvsel dbg v1 low input bvsel dp[0:7] aa2, ab3, ab2, aa8, r8, w5, u8, ab5 high i/o bvsel drdy t6 low output bvsel 4 dti[0:3]) p2, t5, u3, p6 high input bvsel 4, 13 ext_qual b9 high input bvsel 9 gbl m4 low i/o bvsel
32 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice pinout listings for the 483 cbga package gnd a22, b1, b5, b12, b14, b16, b18, b20, c3, c9, c21, d7, d13, d15, d17, d19, e2, e5, e21, f10, f12, f14, f16, f19, g4, g7, g17, g21, h13, h15, h19, h5, j3, j10, j12, j14, j17, j21, k5, k9, k11, k13, k15, k19, l10, l12, l14, l17, l21, m3, m6, m9, m11, m13, m19, n10, n12, n14, n17, n21, p3, p9, p11, p13, p15, p19, r17, r21, t13, t15, t19, t4, t7, t9, u17, u21, v2, v5, v8, v12, v15, v19, w7, w17, w21, y3, y9, y13, y15, y20, aa5, aa17, ab1, ab22 n/a gv dd b13, b15, b17, b19, b21, d12, d14, d16, d18, d21, e19, f13, f15, f17, f21, g19, h12, h14, h17, h21, j19, k17, k21, l19, m17, m21, n19, p17, p21, r15, r19, t17, t21, u19, v17, v21, w19, y21 n/a 15 hit k2 low output bvsel 4 hreset a3 low input bvsel int j6 low input bvsel l1_tstclk h4 high input bvsel 9 l2_tstclk j2 high input bvsel 12 l3vsel a4 high input n/a 3, 7 l3addr[0:17] l18, k22, l16, k20, k18, j22, j20, h22, j18, k16, h20, g22, f22, g20, h18, e22, j16, f20 high output l3vsel l3_clk[0:1] v22, c17 high output l3vsel l3_cntl [0:1] l20, l22 low output l3vsel l3data[0:63] aa19, ab20, u16, w18, aa20, ab21, aa21, t16, w20, u18, y22, r16, v20, w22, t18, u20, n18, n20, n16, n22, m16, m18, m20, m22, r18, t20, u22, t22, r20, p18, r22, m15, g18, d22, e20, h16, c22, f18, d20, b22, g16, a21, g15, e17, a20, c19, c18, a19, a18, g14, e15, c16, a17, a16, c15, g13, c14, a14, e13, c13, g12, a13, e12, c12 high i/o l3vsel l3dp[0:7] ab19, aa22, p22, p16, c20, e16, a15, a12 high i/o l3vsel l3_echo_clk[0:3] v18, p20, e18, e14 high input l3vsel lssd_mode f6 low input bvsel 2, 7 mcp b8 low input bvsel no connect a8, a11, b6, b11, c11, d11, d3, d5, e11, e7, f2, f11, g11, g2, h11, h9, j8 n/a table 15. pinout listing for the mpc7451, 483 cbga package (continued) signal name pin number active i/o i/f select 1 notes
motorola mpc7451 risc microprocessor hardware specifications 33 preliminarysubject to change without notice pinout listings for the 483 cbga package ov dd b3, c5, c7, c10, d2, e3, e9, f5, g3, g9, h7, j5, k3, l7, m5, n3, p7, r4, t3, u5, u7, u11, u15, v3, v9, v13, y2, y5, y7, y10, y17, y19, aa4, aa15 n/a pll_cfg[0:3] a2, f7, c2, d4 high input bvsel pll_ext h8 high input bvsel pmon_in e6 low input bvsel 10 pmon_out b4 low output bvsel qack k7 low input bvsel qreq y1 low output bvsel shd [0:1] l4, l8 low i/o bvsel 8 smi g8 low input bvsel sreset g1 low input bvsel sysclk d6 input bvsel ta n8 low input bvsel tben l3 high input bvsel tbst b7 low output bvsel tck j7 high input bvsel tdi e4 high input bvsel 7 tdo h1 high output bvsel tea t1 low input bvsel test[0:5] b10, h6, h10, d8, f9, f8 input bvsel 2 test[6] a9 input bvsel 9 tms k4 high input bvsel 7 trst c1 low input bvsel 7, 14 ts p5 low i/o bvsel 8 tsiz[0:2] l1,h3,d1 high output bvsel tt[0:4] f1, f4, k8, a5, e1 high i/o bvsel wt l2 low output bvsel 8 table 15. pinout listing for the mpc7451, 483 cbga package (continued) signal name pin number active i/o i/f select 1 notes
34 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice package description 1.8 package description the following sections provide the package parameters and mechanical dimensions for the cbga package. 1.8.1 package parameters for the mpc7451, 483 cbga the package parameters are as provided in the following list. the package type is 29 29 mm, 483-lead ceramic ball grid array (cbga). package outline 29 29 mm interconnects 483 (22 22 ball array C 1) pitch 1.27 mm (50 mil) minimum module height maximum module height 3.22 mm ball diameter 0.89 mm (35 mil) v dd j9, j11, j13, j15, k10, k12, k14, l9, l11, l13, l15, m10, m12, m14, n9, n11, n13, n15, p10, p12, p14 n/a notes: 1. ov dd supplies power to the processor bus, jtag, and all control signals except the l3 cache controls (l3ctl[0:1]); gv dd supplies power to the l3 cache interface (l3addr[0:17], l3data[0:63], l3dp[0:7], l3_echo_clk[0:3], and l3_clk[0:1]) and the l3 control signals l3_cntl [0:1]; and v dd supplies power to the processor core and the pll (after filtering to become av dd ). for actual recommended value of v in or supply voltages, see table 4. 2. these input signals are for factory use only and must be pulled up to ov dd for normal machine operation. 3. to program the processor interface i/o voltage, connect bvsel to either gnd (selects 1.8 v) or to hreset (selects 2.5 v). to program the l3 interface, connect l3vsel to either gnd (selects 1.8 v) or to hreset (selects 2.5 v) or to hreset (selects 1.5 v). if used, pulldown resistors should be less than 250 w . 4. ignored in 60x bus mode. 5. this signal selects between mpx bus mode (asserted) and 60x bus mode (negated) and will be sampled at hreset going high. 6. this signal must be negated during reset, by pull-up to ov dd or negation by ?hreset (inverse of hreset ), to ensure proper operation. 7. internal pull-up on die. 8. these pins require weak pull-up resistors (for example, 4.7 k w ) to maintain the control signals in the negated state after they have been actively negated and released by the mpc7451 and other bus masters. 9. these input signals for factory use only and must be pulled down to gnd for normal machine operation. 10. this pin can externally enable the performance monitor counters (pmc) if they are internally enabled by the software. if it will not be used to control the pmc, it should be pulled down to gnd so that the software can enable the pmc. 11. unused address pins must be pulled down to gnd. 12. this test signal is recommended to be tied to hreset ; however, other configurations will not adversely affect performance. 13. these signals must be pulled down to gnd if unused or if the mpc7451 is in 60x bus mode. 14. this signal must be asserted during reset, by pull-down to gnd or assertion by hreset , to ensure proper operation. 15. power must be supplied to gv dd , even when the l3 interface is disabled or unused. table 15. pinout listing for the mpc7451, 483 cbga package (continued) signal name pin number active i/o i/f select 1 notes
motorola mpc7451 risc microprocessor hardware specifications 35 preliminarysubject to change without notice package description 1.8.2 mechanical dimensions for the mpc7451, 483 cbga figure 19 provides the mechanical dimensions and bottom surface nomenclature for the mpc7451, 483 cbga package. figure 19. mechanical dimensions and bottom surface nomenclature for the mpc7451, 483 cbga 0.2 2x notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. dimensions in millimeters. 3. top side a1 corner index is a metalized feature with various shapes. bottom side. a1 corner is designated with a ball missing from the array. d a1 corner e e 0.2 2x c b 12345678910111213141516 a b c d e f g h j k l m n p r t a a1 a2 a 0.2 a 171819 u w v millimeters dim min max a--3.22 a1 0.80 1.00 a2 1.08 1.32 a3 -- 0.60 b 0.82 0.93 d 29.00 bsc d1 11.6 d2 8.94 d3 6.9 e 1.27 bsc e 29.00 bsc e1 11.6 e2 8.94 e3 6.9 c a 483x b 0.3 a 0.15 b 20 21 22 y aa ab capacitor region 1 d1 d3 e1 e3 d2 e2 a3
36 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice system design information 1.9 system design information this section provides system and thermal design recommendations for successful application of the mpc7451. 1.9.1 pll configuration the mpc7451 pll is configured by the pll_ext and pll_cfg[0:3] signals. for a given sysclk (bus) frequency, the pll configuration signals set the internal cpu and vco frequency of operation. pll_ext will normally be pulled low but can be asserted for extended modes of operation. the pll configuration for the mpc7451 is shown in table 16 for a set of example frequencies. in this example, shaded cells represent settings that, for a given sysclk frequency, result in core and/or vco frequencies that do not comply with the 600-mhz column in table 8. table 16. mpc7451 microprocessor pll configuration example for 600 mhz parts pll_ext pll_cfg [0:3] example bus-to-core frequency in mhz (vco frequency in mhz) bus-to- core multiplier core-to- vco multiplier bus 33.3 mhz bus 50 mhz bus 66.6 mhz bus 75 mhz bus 83 mhz bus 100 mhz bus 133 mhz 000000.5x2x 16 (33) 25 (50) 33 (66) 37 (75) 47 (83) 50 (100) 66 (133) 001002x 2x 66 (133) 100 (200) 133 (266) 150 (300) 166 (333) 200 (400) 266 (533) 001102.5x2x 83 (166) 125 (250) 166 (333) 187 (375) 208 (415) 250 (500) 333 (666) 010003x 2x 100 (200) 150 (300) 200 (400) 225 (450) 250 (500) 300 (600) 400 (800) 0 1110 3.5x 2x 116 (233) 175 (350) 233 (466) 262 (525) 291 (581) 350 (700) 466 (933) 010104x 2x 133 (266) 200 (400) 266 (533) 300 (600) 333 (666) 400 (800) 533 (1066) 0 0111 4.5x 2x 150 (300) 225 (450) 300 (600) 337 (675) 374 (747) 450 (900) 600 (1200) 0 1011 5x 2x 166 (333) 250 (500) 333 (666) 375 (750) 415 (830) 500 (1000) 667 (1333) 010015.5x2x 183 (366) 275 (550) 366 (733) 412 (825) 457 (913) 550 (1100) 733 (1466) 0 1101 6x 2x 200 (400) 300 (600) 400 (800) 450 (900) 498 (996) 600 (1200) 001016.5x2x 216 (433) 325 (630) 433 (866) 488 (975) 540 (1080) 650 (1300) 000107x 2x 233 (466) 350 (700) 466 (933) 525 (1050) 581 (1162) 700 (1400) 000017.5x2x 250 (500) 375 (750) 500 (1000) 563 (1125) 623 (1245) 750 (1500) 0 1100 8x 2x 266 (533) 400 (800) 533 (1066) 600 (1200) 664 (1328)
motorola mpc7451 risc microprocessor hardware specifications 37 preliminarysubject to change without notice system design information the mpc7451 generates the clock for the external l3 synchronous data srams by dividing the core clock frequency of the mpc7451. the core-to-l3 frequency divisor for the l3 pll is selected through the l3_clk bits of the l3cr register. generally, the divisor must be chosen according to the frequency supported by the external rams, the frequency of the mpc7451 core, and timing analysis of the circuit board routing. table 17 shows various example l3 clock frequencies that can be obtained for a given set of core frequencies. 1 0111 9x 2x 300 (600) 450 (900) 600 (1200) 675 (1350) 747 (1494) 1 1010 10x 2x 333 (666) 500 (1000) 667 (1333) 750 (1500) 1 1001 11x 2x 366 (733) 550 (1100) 733 (1466) 1 1011 12x 2x 400 (800 600 (1200) 1 0101 13x 2x 433 (866) 650 (1300) 1 1100 14x 2x 466 (933) 700 (1400) 1 0001 15x 2x 500 (1000) 750 (1500) 1 1101 16x 2x 533 (1066) 0 0011 pll off/bypass pll off, sysclk clocks core circuitry directly 0 1111 pll off pll off, no core clocking occurs notes: 1. pll_cfg[0:3] settings not listed are reserved. 2. the sample bus-to-core frequencies shown are for reference only. some pll configurations may select bus, core, or vco frequencies which are not useful, not supported, or not tested for by the mpc7451; see section 1.5.2.1, clock ac specifications, for valid sysclk, core, and vco frequencies. 3. in pll-bypass mode, the sysclk input signal clocks the internal processor directly and the pll is disabled. however, the bus interface unit requires a 2x clock to function. therefore, an additional signal, ext_qual, must be driven at one-half the frequency of sysclk and offset in phase to meet the required input setup t ivkh and hold time t ixkh (see table 9). the result will be that the processor bus frequency will be one-half sysclk while the internal processor is clocked at sysclk frequency. this mode is intended for factory use and emulator tool use only. note : the ac timing specifications given in this document do not apply in pll-bypass mode. 4. in pll-off mode, no clocking occurs inside the mpc7451 regardless of the sysclk input. table 16. mpc7451 microprocessor pll configuration example for 600 mhz parts (continued) pll_ext pll_cfg [0:3] example bus-to-core frequency in mhz (vco frequency in mhz) bus-to- core multiplier core-to- vco multiplier bus 33.3 mhz bus 50 mhz bus 66.6 mhz bus 75 mhz bus 83 mhz bus 100 mhz bus 133 mhz
38 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice system design information 1.9.2 pll power supply filtering the av dd power signal is provided on the mpc7451 to provide power to the clock generation pll. to ensure stability of the internal clock, the power supplied to the av dd input signal should be filtered of any noise in the 500 khz to 10 mhz resonant frequency range of the pll. a circuit similar to the one shown in figure 20 using surface mount capacitors with minimum effective series inductance (esl) is recommended. the circuit should be placed as close as possible to the av dd pin to minimize noise coupled from nearby circuits. it is often possible to route directly from the capacitors to the av dd pin, which is on the periphery of the 360 cbga footprint and very close to the periphery of the 483 cbga footprint, without the inductance of vias. figure 20. pll power supply filter circuit 1.9.3 power supply voltage sequencing the notes in table 2 contain cautions about the sequencing of the external bus voltages and core voltage of the mpc7451 (when they are different). these cautions are necessary for the long-term reliability of the part. if they are violated, the electrostatic discharge (esd) protection diodes will be forward-biased and excessive current can flow through these diodes. if the system power supply design does not control the voltage sequencing, the circuit shown in figure 21 can be added to meet these requirements. the 30bf10 table 17. sample core-to-l3 frequencies core frequency (mhz) 2 2.5 3 3.5 4 5 6 500 250 200 167 143 125 100 83 533 266 213 178 152 133 107 89 550 275 220 183 157 138 110 92 600 300 240 200 171 150 120 100 650 2 325 260 217 186 163 130 108 666 2 333 266 222 190 167 133 111 700 2 350 280 233 200 175 140 117 733 2 367 293 244 209 183 147 122 notes: 1. the core and l3 frequencies are for reference only. some examples may represent core or l3 frequencies which are not useful, not supported, or not tested for the mpc7451 ; see section 1.5.2.3, l3 clock ac specifications, for valid l3_clk frequencies. (shaded cells do not comply with table 10.) 2. these core frequencies are not supported by all speed grades; see table 8. v dd av dd 10 w 2.2 f 2.2 f gnd low esl surface mount capacitors
motorola mpc7451 risc microprocessor hardware specifications 39 preliminarysubject to change without notice system design information diodes (see figure 21) control the maximum potential difference between the external bus and core power supplies on power-up and the 1n5820 diodes regulate the maximum potential difference on power-down. figure 21. example voltage sequencing circuit 1.9.4 decoupling recommendations due to the mpc7451 dynamic power management feature, large address and data buses, and high operating frequencies, the mpc7451 can generate transient power surges and high frequency noise in its power supply, especially while driving large capacitive loads. this noise must be prevented from reaching other components in the mpc7451 system, and the mpc7451 itself requires a clean, tightly regulated source of power. therefore, it is recommended that the system designer place at least one decoupling capacitor at each v dd , ov dd , and gv dd pin of the mpc7451. it is also recommended that these decoupling capacitors receive their power from separate v dd , ov dd /gv dd , and gnd power planes in the pcb, utilizing short traces to minimize inductance. these capacitors should have a value of 0.01 f or 0.1 f. only ceramic surface mount technology (smt) capacitors should be used to minimize lead inductance, preferably 0508 or 0603 orientations where connections are made along the length of the part. consistent with the recommendations of dr. howard johnson in high speed digital design: a handbook of black magic (prentice hall, 1993) and contrary to previous recommendations for decoupling motorola microprocessors, multiple small capacitors of equal value are recommended over using multiple values of capacitance. in addition, it is recommended that there be several bulk storage capacitors distributed around the pcb, feeding the v dd , gv dd , and ov dd planes, to enable quick recharging of the smaller chip capacitors. these bulk capacitors should have a low equivalent series resistance (esr) rating to ensure the quick response time necessary. they should also be connected to the power and ground planes through two vias to minimize inductance. suggested bulk capacitors: 100C330 f (avx tps tantalum or sanyo oscon). 1.9.5 connection recommendations to ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal level. unused active low inputs should be tied to ov dd . unused active high inputs should be connected to gnd. all nc (no-connect) signals must remain unconnected. power and ground connections must be made to all external v dd , ov dd , gv dd , and gnd pins in the mpc7451. if the l3 interface is not used, gv dd should be connected to the ov dd power phase, and l3vsel should be connected to bvsel. 2.5 v 1.6 v 1n5820 1n5820 30bf10 30bf10
40 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice system design information 1.9.6 output buffer dc impedance the mpc7451 processor bus and l3 i/o drivers are characterized over process, voltage, and temperature. to measure z 0 , an external resistor is connected from the chip pad to ov dd or gnd. then, the value of each resistor is varied until the pad voltage is ov dd /2 (see figure 22). the output impedance is the average of two components, the resistances of the pull-up and pull-down devices. when data is held low, sw2 is closed (sw1 is open), and r n is trimmed until the voltage at the pad equals ov dd /2. r n then becomes the resistance of the pull-down devices. when data is held high, sw1 is closed (sw2 is open), and r p is trimmed until the voltage at the pad equals ov dd /2. r p then becomes the resistance of the pull-up devices. r p and r n are designed to be close to each other in value. then, z 0 = (r p + r n )/2. figure 22. driver impedance measurement table 18 summarizes the signal impedance results. the impedance increases with junction temperature and is relatively unaffected by bus voltage. 1.9.7 pull-up/pull-down resistor requirements the mpc7451 requires high-resistive (weak: 4.7 k w ) pull-up resistors on several control pins of the bus interface to maintain the control signals in the negated state after they have been actively negated and released by the mpc7451 or other bus masters. these pins are: ts , artry , shdo , and shd1 . some pins designated as being for factory test must be pulled up to ov dd or down to gnd to ensure proper device operation. for the mpc7451, 483 bga, the pins that must be pulled up to ov dd are: lssd_mode and test[0:5]; the pins that must be pulled down are: l1_tstclk and test[6]. table 18. impedance characteristics v dd = 1.5 v, ov dd = 1.8 v 5%, t j = 5 C85c impedance processor bus l3 bus unit z 0 typical 33C42 34C42 w maximum 31C51 32C44 w ov dd ognd r p r n pad data sw1 sw2
motorola mpc7451 risc microprocessor hardware specifications 41 preliminarysubject to change without notice system design information in addition, the mpc7451 has one open-drain style output that requires a pull-up resistor (weak or stronger: 4.7 k w C1 k w ) if it is used by the system. this pin is ckstp_out . if pull-down resistors are used to configure bvsel or l3vsel, the resistors should be less than 250 w (see table 15). during inactive periods on the bus, the address and transfer attributes may not be driven by any master and may, therefore, float in the high-impedance state for relatively long periods of time. because the mpc7451 must continually monitor these signals for snooping, this float condition may cause excessive power draw by the input receivers on the mpc7451 or by other receivers in the system. it is recommended that these signals be pulled up through weak (4.7 k w ) pull-up resistors by the system, or that they may be otherwise driven by the system during inactive periods of the bus. the snooped address and transfer attribute inputs are: a[0:35], ap[0:4], tt[0:4], ci , wt , and gbl . if extended addressing is not used, a[0:3] are unused and must be be pulled low to gnd through weak pull-down resistors. if the mpc7451 is in 60x bus mode, dti[0:3] must be pulled low to gnd through weak pull-down resistors. the data bus input receivers are normally turned off when no read operation is in progress and, therefore, do not require pull-up resistors on the bus. other data bus receivers in the system, however, may require pull-ups, or that those signals be otherwise driven by the system during inactive periods by the system. the data bus signals are: d[0:63] and dp[0:7]. if address or data parity is not used by the system, and the respective parity checking is disabled through hid0, the input receivers for those pins are disabled, and those pins do not require pull-up resistors and should be left unconnected by the system. if all parity generation is disabled through hid0, then all parity checking should also be disabled through hid0, and all parity pins may be left unconnected by the system. the l3 interface does not normally require pull-up resistors. 1.9.8 jtag configuration signals boundary scan testing is enabled through the jtag interface signals. the trst signal is optional in the ieee 1149.1 specification, but is provided on all processors that implement the powerpc architecture. while it is possible to force the tap controller to the reset state using only the tck and tms signals, more reliable power-on reset performance will be obtained if the trst signal is asserted during power-on reset. because the jtag interface is also used for accessing the common on-chip processor (cop) function, simply tying trst to hreset is not practical. the cop function of these processors allows a remote computer system (typically, a pc with dedicated hardware and debugging software) to access and control the internal operations of the processor. the cop interface connects primarily through the jtag port of the processor, with some additional status monitoring signals. the cop port requires the ability to independently assert hreset or trst in order to fully control the processor. if the target system has independent reset sources, such as voltage monitors, watchdog timers, power supply failures, or push-button switches, then the cop reset signals must be merged into these signals with logic. the arrangement shown in figure 23 allows the cop to independently assert hreset or trst , while ensuring that the target can drive hreset as well. an optional pull-down resistor on trst can be populated to ensure that the jtag scan chain is initialized during power-on if the jtag interface and cop header will not be used; otherwise, this resistor should be unpopulated and trst is asserted when the system reset signal (hreset ) is asserted and the jtag interface is responsible for driving trst when needed.
42 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice system design information the cop header shown in figure 23 adds many benefitsbreakpoints, watchpoints, register and memory examination/modification, and other standard debugger features are possible through this interfaceand can be as inexpensive as an unpopulated footprint for a header to be added when needed. the cop interface has a standard header for connection to the target system, based on the 0.025" square-post, 0.100" centered header assembly (often called a berg header). the connector typically has pin 14 removed as a connector key. there is no standardized way to number the cop header shown in figure 23; consequently, many different pin numbers have been observed from emulator vendors. some are numbered top-to-bottom then left-to-right, while others use left-to-right then top-to-bottom, while still others number the pins counter clockwise from pin 1 (as with an ic). regardless of the numbering, the signal placement recommended in figure 23 is common to all known emulators. the qack signal shown in figure 23 is usually connected to the pci bridge chip in a system and is an input to the mpc7451 informing it that it can go into the quiescent state. under normal operation this occurs during a low-power mode selection. in order for cop to work, the mpc7451 must see this signal asserted (pulled down). while shown on the cop header, not all emulator products drive this signal. if the product does not, a pull-down resistor can be populated to assert this signal. additionally, some emulator products implement open-drain type outputs and can only drive qack asserted; for these tools, a pull-up resistor can be implemented to ensure this signal is deasserted when it is not being driven by the tool. note that the pull-up and pull-down resistors on the qack signal are mutually exclusive and it is never necessary to populate both in a system. to preserve correct power down operation, qack should be merged via logic so that it also can be driven by the pci bridge.
motorola mpc7451 risc microprocessor hardware specifications 43 preliminarysubject to change without notice system design information figure 23. jtag interface connection hreset hreset from target board sources hreset 13 sreset sreset sreset nc nc 11 vdd_sense 6 5 1 15 2 k w 10 k w 10 k w 10 k w ov dd ov dd ov dd ov dd chkstp_in chkstp_in 8 tms tdo tdi tck tms tdo tdi tck 9 1 3 4 trst 7 16 2 10 12 (if any) cop header 14 2 key notes: 1. run/stop , normally found on pin 5 of the cop header, is not implemented on the mpc7450. connect pin 5 of the cop header to ov dd with a 10 k w pull-up resistor. 2. key location; pin 14 is not physically present on the cop header. . qack ov dd ov dd 10 k w ov dd 2 k w 3 gnd 3. component not populated. populate only if jtag interface is unused. trst 10 k w ov dd 10 k w 10 k w qack 2 k w 4 qack chkstp_out chkstp_out 3 13 9 5 1 6 10 2 15 11 7 16 12 8 4 key no pin cop connector physical pin out 4. component not populated. populate only if debug tool does not drive qack . 10 k w 5 ov dd 5. populate only if debug tool uses an open-drain type output and does not actively deassert qack . 1 2 k w 4
44 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice system design information 1.9.9 thermal management information this section provides thermal management information for the ceramic ball grid array (cbga) package for air-cooled applications. proper thermal control design is primarily dependent on the system-level designthe heat sink, airflow, and thermal interface material. to reduce the die-junction temperature, heat sinks may be attached to the package by several methodsspring clip to holes in the printed-circuit board or package, and mounting clip and screw assembly (see figure 24); however, due to the potential large mass of the heat sink, attachment through the printed circuit board is suggested. if a spring clip is used, the spring force should not exceed 5.5 pounds. figure 24. package exploded cross-sectional view with several heat sink options the board designer can choose between several types of heat sinks to place on the mpc7451. there are several commercially available heat sinks for the mpc7451 provided by the following vendors: chip coolers inc. 800-227-0254 (usa/canada) 333 strawberry field rd. 401-739-7600 warwick, ri 02887-6979 internet: www.chipcoolers.com international electronic research corporation (ierc) 818-842-7277 135 w. magnolia blvd. burbank, ca 91502 internet: www.ctscorp.com thermalloy 972-243-4321 2021 w. valley view lane dallas, tx 75234-8993 internet: www.thermalloy.com wakefield engineering 781-406-3000 100 cummings center, suite 157h beverly, ma 01915 internet: www.wakefield.com thermal interface material heat sink cbga package heat sink clip printed-circuit board
motorola mpc7451 risc microprocessor hardware specifications 45 preliminarysubject to change without notice system design information aavid engineering 972-551-7330 250 apache trail terrell, tx 75160 internet: www.aavid.com cool innovations inc. 905-760-1992 260 spinnaker way, unit 8 concord, ontario l4k 4p9 canada internet: www.coolinnovations.com ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. 1.9.9.1 internal package conduction resistance for the exposed-die packaging technology, shown in table 3, the intrinsic conduction thermal resistance paths are as follows: ? the die junction-to-case (or top-of-die for exposed silicon) thermal resistance ? the die junction-to-ball thermal resistance figure 25 depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit board. figure 25. c4 package with heat sink mounted to a printed-circuit board heat generated on the active side of the chip is conducted through the silicon, then through the heat sink attach material (or thermal interface material), and finally to the heat sink where it is removed by forced-air convection. because the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the silicon may be neglected. thus, the thermal interface material and the heat sink conduction/convective thermal resistances are the dominant terms. external resistance external resistance internal resistance (note the internal versus external package resistance) radiation convection radiation convection heat sink printed-circuit board thermal interface material package/leads die junction die/package
46 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice system design information 1.9.9.2 thermal interface materials a thermal interface material is recommended at the package lid-to-heat sink interface to minimize the thermal contact resistance. for those applications where the heat sink is attached by spring clip mechanism, figure 26 shows the thermal performance of three thin-sheet thermal-interface materials (silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure. as shown, the performance of these thermal interface materials improves with increasing contact pressure. the use of thermal grease significantly reduces the interface thermal resistance. that is, the bare joint results in a thermal resistance approximately 7 times greater than the thermal grease joint. often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see figure 24). therefore, the synthetic grease offers the best thermal performance, considering the low interface pressure and is recommended due to the high power dissipation of the mpc7451. of course, the selection of any thermal interface material depends on many factorsthermal performance requirements, manufacturability, service temperature, dielectric properties, cost, etc. figure 26. thermal performance of select thermal interface material the board designer can choose between several types of thermal interface. heat sink adhesive materials should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment shock/vibration requirements. there are several commercially available thermal interfaces and adhesive materials provided by the following vendors: dow-corning corporation 800-248-2481 dow-corning electronic materials po box 0997 midland, mi 48686-0997 internet: www.dow.com 0 0.5 1 1.5 2 0 1020304050607080 silicone sheet (0.006 inch) bare joint floroether oil sheet (0.007 inch) graphite/oil sheet (0.005 inch) synthetic grease contact pressure (psi) specific thermal resistance (kin 2 /w)
motorola mpc7451 risc microprocessor hardware specifications 47 preliminarysubject to change without notice system design information chomerics, inc. 781-935-4850 77 dragon court woburn, ma 01888-4014 internet: www.chomerics.com thermagon inc. 888-246-9050 3256 west 25th street cleveland, oh 44109-1668 internet: www.thermagon.com loctite corporation 860-571-5100 1001 trout brook crossing rocky hill, ct 06067-3910 internet: www.loctite.com the following section provides a heat sink selection example using one of the commercially available heat sinks. 1.9.9.3 heat sink selection example for preliminary heat sink sizing, the die-junction temperature can be expressed as follows: t j = t a + t r + ( q jc + q int + q sa ) p d where: t j is the die-junction temperature t a is the inlet cabinet ambient temperature t r is the air temperature rise within the computer cabinet q jc is the junction-to-case thermal resistance q int is the adhesive or interface material thermal resistance q sa is the heat sink base-to-ambient thermal resistance p d is the power dissipated by the device during operation, the die-junction temperatures (t j ) should be maintained less than the value specified in table 4. the temperature of the air cooling the component greatly depends upon the ambient inlet air temperature and the air temperature rise within the electronic cabinet. an electronic cabinet inlet-air temperature (t a ) may range from 30 to 40c. the air temperature rise within a cabinet (t r ) may be in the range of 5 to 10c. the thermal resistance of the thermal interface material ( q int ) is typically about 1.5c/w. for example, assuming a t a of 30c, a t r of 5c, a cbga package q jc = 0.1, and a typical power consumption (p d ) of 13.0 w, the following expression for t j is obtained: die-junction temperature: t j = 30c + 5c + (0.1c/w + 1.5c/w + q sa ) 13.0 w for this example, a q sa value of 3.7c/w or less is required to maintain the die junction temperature below the maximum value of table 4. though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure-of-merit used for comparing the thermal performance of various microelectronic packaging technologies, one should exercise caution when only using this metric in determining thermal management because no single parameter can adequately describe three-dimensional heat flow. the final die-junction operating temperature is not only a function of the component-level thermal resistance, but the system-level design and its operating conditions. in addition to the component's power consumption, a number of factors affect the final operating die-junction temperatureairflow, board population (local heat flux of adjacent
48 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice system design information components), heat sink efficiency, heat sink attach, heat sink placement, next-level interconnect technology, system air temperature rise, altitude, etc. due to the complexity and the many variations of system-level boundary conditions for today's microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection, and conduction) may vary widely. for these reasons, we recommend using conjugate heat transfer models for the board, as well as system-level designs.
motorola mpc7451 risc microprocessor hardware specifications 49 preliminarysubject to change without notice document revision history 1.10 document revision history table 19 provides a revision history for this hardware specification. table 19. document revision history document revision substantive change(s) rev 0 initial release. rev 0.1 made final adjustments to document template. changed full-on mode to full-power mode and sleep - pll disabled to deep sleep mode in table 7 to be consistent with users manual. removed specifcation for doze mode power since this is not tested (see table 7, note 4). lowered t khdv in table 9 to 2.5 ns. removed deep sleep mode-max power specification since this is not tested.
50 mpc7451 risc microprocessor hardware specifications motorola preliminarysubject to change without notice ordering information 1.11 ordering information ordering information for the parts fully covered by this specification document is provided in section 1.11.1, part numbers fully addressed by this document. section 1.11.2, part numbers not fully addressed by this document, lists the part numbers which do not fully conform to the specifications of this document. these special part numbers require an additional document called a part number specification. 1.11.1 part numbers fully addressed by this document table 20 provides the motorola part numbering nomenclature for the mpc7451. note that the individual part numbers correspond to a maximum processor core frequency. for available frequencies, contact your local motorola sales office. in addition to the processor frequency, the part numbering scheme also includes an application modifier which may specify special application conditions. each part number also contains a revision level code which refers to the die mask revision number. 1.11.2 part numbers not fully addressed by this document parts with application modifiers or revision levels not fully addressed in this specification document are described in separate part number specifications which supplement and supersede this document; see table 21. table 20. part numbering nomenclature xpc 7451 rx nnn x x product code part identifier package processor frequency 1 application modifier revision level xpc 2 7451 rx = cbga 600 667 l: 1.6 v 50 mv 0 to 105 c g: 2.3; pvr = 8000 0210 notes: 1. processor core frequencies supported by parts addressed by this specification only. parts addressed by part number specifications may support other maximum core frequencies. 2. the x prefix in a motorola part number designates a pilot production prototype as defined by motorola sop 3-13. these are from a limited production volume of prototypes manufactured, tested, and q.a. inspected on a qualified technology to simulate normal production. these parts have only preliminary reliability and characterization data. before pilot production prototypes may be shipped, written authorization from the customer must be on file in the applicable sales office acknowledging the qualification status and the fact that product changes may still occur while shipping pilot production prototypes. table 21. part numbers with separate documentation part number series operating conditions document order number of applicable specification xpc7451rx nnn p x 1.9 v 50 mv, 0 to 65 c mpc7451rxpxpns/d note: for other differences, see applicable specifications.
motorola mpc7451 risc microprocessor hardware specifications 51 preliminarysubject to change without notice ordering information 1.11.3 part marking parts are marked as the example shown in figure 27. figure 27. part marking for bga device bga notes : ccccc is the country of assembly. this space is left blank if parts are assembled in the united states. mmmmmm is the 6-digit mask number. atwlyywwa is the traceability code. xpc7451 rx600lg mmmmmm atwlyywwa 7451
mpc7451ec/d how to reach us: usa/europe/locations not listed: motorola literature distribution; p.o. box 5405, denver, colorado 80217 1-303-675-2140 or 1-800-441-2447 japan: motorola japan ltd.; sps, technical information center, 3-20-1, minami-azabu minato-ku, tokyo 106-8573 japan 81-3-3440-3569 asia/pacific: motorola semiconductors h.k. ltd.; silicon harbour centre, 2 dai king street, tai po industrial estate, tai po, n.t., hong kong 852-26668334 technical information center: 1-800-521-6274 home page: http://www.motorola.com/semiconductors document comments: fax (512) 933-2625, attn: risc applications engineering information in this document is provided solely to enable system and software implementers to use . there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. typical parameters which may be provided in motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including typicals must be validated for each customer application by customers technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a situation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola and the stylized m logo are registered in the u.s. patent and trademark office. digital dna is a trademark of motorola, inc. all other product or service names are the property of their respective owners. motorola, inc. is an equal opportunity/affirmative action employer. ? motorola, inc. 2001
mpc7451 product summary page search advanced | parametric | part number | faq select country motorola home | semiconductors home | contact us semiconductors products | design support | register | login motorola > semiconductors > mpc7451 : host processor the mpc7451 is end of life. possible replacement: mpc7455. motorola's mpc7451 host processor is a high-performance, low-power, 32-bit powerpc processor with a full 128-bit implementation of motorola's altivec? technology. this microprocessor is ideal for leading edge computing, embedded network control, and signal processing applications. the mpc7451 has a new, deeper, seven-stage pipeline with two additional execution units. the l2 cache has been integrated onto the die for greater speed, and supports a large backside l3 cache with a 64-bit datapath. the mpc7451 offers increased address space and high-bandwidth mpx bus with minimized signal setup times and reduced idle cycles to increase bus bandwidth to a maximum speed of 133 mhz. mpc7451 processors offer single-cycle throughput double precision floating-point performance and full symmetric multi-processing (smp) capabilities. finally, the mpc7451 is software-compatible with existing motorola mpc6xx, mpc7xx, and mpc7xxx processors and exploits the full potential of altivec technology. the mpc7441 host processor is a low-power version of the high performance mpc7450 and mpc7451. this microprocessor is a small, 360-pin package that does not include the backside l3 cache. it has a core voltage of 1.5 v and is available at speeds of 600 and 700 mhz. mpc7451 features superscalar microprocessor mpc7451 powerpc processors feature a high-frequency superscalar core, capable of issuing four instructions per clock cycle (three instructions + branch) into eleven independent execution units: l four integer units (3 simple + 1 complex) l double-precision floating-point unit l four altivec units (simple, complex, floating, and permute) l load/store unit l branch processing unit cache and mmu support the mpc7451 processor has separate 32kb, physically addressed instruction and data caches. both l1 caches feature cache way locking and are eight-way set associative. for greater speed, the l2 cache has been integrated on-chip with a 256-bit interface to l1 which operates at processor frequency. this l2 is 256kb eight-way set associative. l2 cache access is fully pipelined. the mpc7451 also supports an l3 cache interface with on-chip tags to support up to 2mb of off-chip cache. the l3 data bus is 64-bits wide, provides multiple sram options, and affords critical quad-word forwarding to reduce latency. the off-chip l3 storage can also be configured as a local addressable memory. finally, in addition to supporting hardware table searching on a tlb miss, the mpc7451 can be configured for software table searching. in this case, tlb entries are loaded by the system software. the mpc7451 processor contains separate memory management units for instructions and data, supporting 4 petabytes (252) of virtual memory and up to 64 gigabytes (236) of physical memory. the mpc7451 also has four instruction block address translation and four data block address translation registers. page contents: features documentation tools orderable parts related links other info: faqs 3rd party design help training 3rd party tool vendors 3rd party trainers rate this page -- - 0 + ++ care to comment? file:///f|/imaging/bitting/cf_process/cpl/11252003/moto/mpc7451ec.htm (1 of 8) [27-nov-03 11:34:16 am]
mpc7451 product summary page mpx bus interface mpc7451 processors support the mpx bus protocol with a 64-bit data bus and a 32- or 36-bit address bus. support is included for burst, split, pipelined and out-of-order transactions, in addition to data streaming, and data intervention (in smp systems). the interface provides snooping for data cache coherency. the mpc7451 implements the cache coherency protocol for multiprocessing support in hardware, allowing access to system memory for additional caching bus masters, such as dma devices. power management mpc7451 processors feature a low-power 1.8-volt design with three power-saving user-programmable modes -- nap, doze (with bus snoop) and sleep -- which progressively reduce the power drawn by the processor. the mpc7451 also provides a thermal assist unit and instruction cache throttling for software- controllable thermal management. altivec technology the altivec technology expands the capabilities of motorola's fourth generation processors by providing leading-edge, general purpose processing performance while concurrently addressing high-bandwidth data processing and algorithmic-intensive computations in a single-chip solution. altivec technology: l meets the computational demands of networking infrastructure such as echo cancellation equipment, and base station processing. l enables faster, more secure encryption methods optimized for the simd processing model. l provides compelling performance for multimedia-oriented desktop computers, desktop publishing, and digital video processing. l enables real-time processing of the most demanding data streams (mpeg-2 encode, continuous speech recognition, real-time high-resolution 3d memory for 3d graphics.) return to top mpc7451 documentation documentation application note id name vendor id format size k rev # date last modified order availability an1794/d backside l2 timing analysis for pcb design engineers motorola pdf 87 0.2 5/22/2003 an1795/d designing powerpc(tm) mpc7400 systems motorola pdf 97 1.1 6/05/2003 an1809 minimal boot sequence for executing compiled c programs on powerpc(tm) devices motorola pdf 270 1.2 11/11/2003 an2077 design checklist for motorola powerpc(tm) microprocessors motorola pdf 309 1.6 11/11/2003 an2097 powerpc(tm) 60x bus implementation differences motorola pdf 135 0.3 8/06/2003 an2106/d powerpc(tm) mpx bus implementation differences motorola pdf 76 0.1 6/05/2003 an2114/d complex fixed-point fast fourier transform optimization for altivec(tm) motorola pdf 158 2.1 6/03/2003 an2115/d complex floating point fast fourier transform optimization for altivec(tm) motorola pdf 151 2.1 6/03/2003 an2161 outstanding data tenures on the mpx bus motorola pdf 95 0.1 8/04/2003 an2180 cache latencies of the 7451 motorola pdf 87 0.2 8/04/2003 file:///f|/imaging/bitting/cf_process/cpl/11252003/moto/mpc7451ec.htm (2 of 8) [27-nov-03 11:34:16 am]
mpc7451 product summary page an2182 setting the sample points for the mpc7450 l3 cache motorola pdf 0 0 8/14/2001 an2203/d mpc7450 risc microprocessor family software optimization guide motorola pdf 1152 1 7/30/2002 an2273 building an nfs dhcp/bootp server for use with sandpoint and mvp linux motorola pdf 0 1.1 6/10/2003 an2435 thermal solutions for powerpc(tm) processors motorola pdf 125 0 7/28/2003 an2436 specifying power consumption motorola pdf 225 0.2 11/11/2003 an2489/d upgrading software from mpc7451 to mpc7455 or mpc7457 motorola pdf 241 0.1 6/11/2003 an2491 simplified mnemonics for powerpc instructions motorola pdf 524 0 9/30/2003 an2540 synchronizing instructions for powerpc(tm) instruction set architecture motorola pdf 0 0.1 7/03/2003 an2581 altivec performance enhancement in a multiprocessing environment motorola pdf 341 0 10/10/2003 data sheets id name vendor id format size k rev # date last modified order availability mpc7451ec/d mpc7451 risc microprocessor hardware specifications motorola pdf 2859 0.1 11/15/2001 mpc7451rxpxpns/d mpc7451 part number specification for the xpc7451rxnnnpx series motorola pdf 63 0 5/03/2002 mpc7451rxsxpns/d mpc7451 part number specification for the xpc7451rxnnnsx series motorola pdf 60 0 5/02/2002 errata - click here for important errata information id name vendor id format size k rev # date last modified order availability mpc7450ce mpc7450 family chip errata for the mpc7451, mpc7450, and mpc7441 motorola pdf 505 14.1 11/19/2003 fact sheets id name vendor id format size k rev # date last modified order availability altivecfact/d altivec fact sheet motorola pdf 160 2 2/20/2003 altivecwp motorola's altivec technology motorola pdf 171 0 1/01/1998 mpc7450- 51fact/d high performance host microprocessor motorola pdf 40 2 4/08/2002 - mpc7451fact/d mpc7451/mpc7450 high-performance 32-bit microprocessor motorola pdf 57 0 12/20/2001 - ppcsalesfact/d powerpc processors at-a-glance motorola pdf 234 1 2/17/2003 packaging information id name vendor id format size k rev # date last modified order availability pbgapres pbga packaging customer tutorial motorola pdf 1923 1 8/05/2003 - tbgaprespkg tbga packaging customer tutorial motorola pdf 1784 0 8/05/2003 - file:///f|/imaging/bitting/cf_process/cpl/11252003/moto/mpc7451ec.htm (3 of 8) [27-nov-03 11:34:16 am]
mpc7451 product summary page product brief id name vendor id format size k rev # date last modified order availability mpc7450ts/d mpc7450 risc microprocessor family technical summary motorola pdf 405 3 2/12/2003 product change notices id name vendor id format size k rev # date last modified order availability pcn7919 xpc7450 family end-of-life motorola htm 7 0 8/21/2002 - pcn8926 740a/750a/7441/7451 end of life motorola htm 8 0 5/28/2003 - reference manual id name vendor id format size k rev # date last modified order availability altivecpem/d altivec technology programming environments manual motorola pdf 3893 2.0 2/28/2002 altivecpim_d altivec technology programming interface manual motorola pdf 0 0 6/01/1999 - mpc7450um mpc7450 risc microprocessor family user's manual motorola pdf 9494 3 2/10/2003 mpc7450umad/d mpc7450 user manual errata motorola pdf 50 1 11/27/2001 - mpc7450um_zip mpc7450 users manual (compressed) motorola zip 0 3 2/10/2003 - mpcbusif/ad the bus interface for 32-bit microprocessors that implement the powerpc architecture motorola pdf 916 0 3/31/1997 mpcfpe32b/ad programming environments manual for 32-bit implementations of the powerpc architecture motorola pdf 6909 2 12/21/2001 mpcfpe32bad/ad errata to mpcfpe32b, programming environments manual for 32-bit implementations of the power pc architecture, rev. 2 motorola pdf 40 0 10/11/2002 - mpcprgref/d powerpc microprocessor family: the programmer's pocket reference guide motorola pdf 375 0 1/01/1996 reliability and quality information id name vendor id format size k rev # date last modified order availability xpc7450rqi mpc7450/mpc7451 mos 13 hip6l high temperature operating life data report (rev 2.0.2 - 2.3) motorola pdf 56 a 1/18/2002 - reports or presentations id name vendor id format size k rev # date last modified order availability ppccpusumm motorola host and integrated processor summary motorola pdf 6 1 2/10/2003 - roadmap id name vendor id format size k rev # date last modified order availability ppcrmap motorola host processor strategy roadmap motorola pdf 122 - 11/30/2001 - supporting information id name vendor id format size k rev # date last modified order availability ppcpvr motorola host processor version register settings motorola pdf 6 16 10/17/2003 - file:///f|/imaging/bitting/cf_process/cpl/11252003/moto/mpc7451ec.htm (4 of 8) [27-nov-03 11:34:16 am]
mpc7451 product summary page white paper id name vendor id format size k rev # date last modified order availability altivectcpipwp/d enhanced tcp/ip performance with altivec motorola pdf 152 1.0 1/21/2003 - g4wp g4 architecture white paper motorola pdf 53 0 1/23/2001 - mpc603overallwp/d motorola powerpc 603 and powerpc 604 risc microprocessor: the c4/ceramic-ball-grid array interconnect technology motorola pdf 112 0 5/01/1996 - mpc603thermalwp/d thermal management of a c4/ceramic-ball-grid array: the motorola powerpc 603 and powerpc 604 risc microprocessors motorola pdf 86 0 5/01/1996 - mpc74xxmbuswp_d memory bus throughput of the mpc74xx motorola pdf 95 1.1 11/20/2003 - return to top mpc7451 tools hardware tools board testers id name vendor id format size k rev # order availability scanplus scanplus corelis - - - - emulators/probes/wigglers id name vendor id format size k rev # order availability bdi1000/bdi2000 bdi1000/bdi2000 abatron - - - - 10200a netice-r option 2/2m corelis - - - - probe green hills probe & slingshot greenhills - - - - visionice visionice ii windriv - - - - visionprobe visionprobe ii windriv - - - - wpice wind?power ice windriv - - - - evaluation/development boards and systems id name vendor id format size k rev # order availability mvpx3 mvp x3 multiprocessing verification platform - motherboard motorola - - - - sandpointx3 sandpoint x3 evaluation system - motherboard motorola - - - - ppceval-sp3- 7451 sandpoint x3 motherboard with valis x3 mpc7451 pmc module motorola - - - ppceval-sp3- 7451_x2 sandpoint x3 motherboard with valis x2 mpc7451 pmc module (discontinued version) motorola - - - - file:///f|/imaging/bitting/cf_process/cpl/11252003/moto/mpc7451ec.htm (5 of 8) [27-nov-03 11:34:16 am]
mpc7451 product summary page models bsdl id name vendor id format size k rev # order availability mpc7451r2xbsdl mpc7451 bsdl file for rev. 2.x of silicon package type: cbga, voltage level: 2.5v (07/15/2002) motorola r2c 56 c - bus functional models id name vendor id format size k rev # order availability mpc7450bfm mpc7450 bus functional model (02/12/2002) motorola gz 1268 1.1 - full functional models id name vendor id format size k rev # order availability ep100 powerpc bus slave eureka - - - - ep201 powerpc bus master eureka - - - - ep300 powerpc bus arbiter eureka - - - - ep433 powerpc-pci bridge eureka - - - - es100 powerpc system controller eureka - - - - ibis id name vendor id format size k rev # order availability mpc7451aibis mpc7451 rev 2.1, 484 bga package, 2.5 i/o, 2.5 l3 ibis motorola txt 106 2.1 - mpc7451bibis mpc7451 rev 2.1, 484 bga package, 2.5 i/o, 1.8 l3 ibis motorola txt 102 2.1 - mpc7451cibis mpc7451 rev 2.1, 484 bga package, 2.5 i/o, 1.5 l3 ibis motorola txt 101 2.1 - mpc7451dibis mpc7451 rev 2.1, 484 bga package, 1.8 i/o, 2.5 l3 ibis motorola txt 101 2.1 - mpc7451eibis mpc7451 rev 2.1, 484 bga package, 1.8 i/o, 1.8 l3 ibis motorola txt 97 2.1 - mpc7451fibis mpc7451 rev 2.1, 484 bga package, 1.8 i/o, 1.5 l3 ibis motorola txt 96 2.1 - software application software application development framework id name vendor id format size k rev # order availability npmgmt np management application framework kenati - - - - calculators id name vendor id format size k rev # order availability l3spcalc l3 sample point calculator spreadsheet to assist in calculating l3 sample points. use with an2182. (05/01/2002) motorola xls 30 0 - dink32 id name vendor id format size k rev # order availability dink32 rom-based debug monitor, r13.1.1 motorola - - - - file:///f|/imaging/bitting/cf_process/cpl/11252003/moto/mpc7451ec.htm (6 of 8) [27-nov-03 11:34:16 am]
mpc7451 product summary page board support packages id name vendor id format size k rev # order availability nplinux np linux kenati - - - - device drivers id name vendor id format size k rev # order availability nplinux np linux kenati - - - - operating systems id name vendor id format size k rev # order availability dpp.7xxx.krn ose real-time operating system enea - - - - nplinux np linux kenati - - - - protocol stacks id name vendor id format size k rev # order availability mstp anvimstp avnisoft's avnimstp is a completely portable ansi c compliant implementation of the ieee 802.1s mstp. it is implemented on top of, and includes the avniport platform abstraction layer to simplify integration with target platforms. avnisoft - - - - cmx tcp/ip cmx tcp/ip cmx - - - - npstack np network stack kenati - - - - software tools code translation id name vendor id format size k rev # order availability pa68k-ppc portasm/68k for powerpc microapl - - - - pa86-ppc portasm/86 for powerpc microapl - - - - compilers id name vendor id format size k rev # order availability cweppc codewarrior development studio for powerpc isa metrowerks - - - cwlinppc codewarrior development studio. linux application edition for powerpc metrowerks - - - arc-mot- compiler metaware c/c++ compiler tool suite arc - - - - multi compiler multi compiler for powerpc greenhills - - - - diab diab c/c++ compiler windriv - - - - debuggers id name vendor id format size k rev # order availability cwlinppc codewarrior development studio. linux application edition for powerpc metrowerks - - - arc-mot- debugger seecode c/c++ debugger arc - - - - powerpc debugger multi debugger greenhills - - - - file:///f|/imaging/bitting/cf_process/cpl/11252003/moto/mpc7451ec.htm (7 of 8) [27-nov-03 11:34:16 am]
mpc7451 product summary page ide (integrated development environment) id name vendor id format size k rev # order availability cwlinppc codewarrior development studio. linux application edition for powerpc metrowerks - - - multi multi greenhills - - - - ic-sw-opr winidea isys - - - - wpide wind?power ide windriv - - - - return to top orderable parts information partnumber package info tape and reel life cycle description (code) budgetary price qty 1000+ ($us) additional info order availability KXPC7451RX667LG fccbga 483 29sq*3.2p1.27 no prod phase out/see last ord dt(6) 01 dec 2003 - more xpc7451rx600lg fccbga 483 29sq*3.2p1.27 no prod phase out/see last ord dt(6) 01 dec 2003 - more xpc7451rx667lg fccbga 483 29sq*3.2p1.27 no prod phase out/see last ord dt(6) 01 dec 2003 - more xpc7451rx800sg fccbga 483 29sq*3.2p1.27 no prod phase out/see last ord dt(6) 01 dec 2003 - more - xpc7451rx867pg fccbga 483 29sq*3.2p1.27 no prod phase out/see last ord dt(6) 01 dec 2003 - more - note: are you looking for an obsolete orderable part? click here to check our distributors' inventory. return to top related links networking powerpc? processors altivec technology return to top http://www.motorola.com/ | site map | contact motorola | terms of use | privacy practices ? copyright 1994-2003 motorola, inc. all rights reserved. file:///f|/imaging/bitting/cf_process/cpl/11252003/moto/mpc7451ec.htm (8 of 8) [27-nov-03 11:34:16 am]

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